Abstract: Fluoroolefin/acid group or protected acid group-containing copolymers for photoresist compositions and microlithography methods employing the photoresist compositions are described. These copolymer compositions comprise 1) at least one fluoroolefin, preferably hexafluoroisobutylene, and 2) an acid group or a protected acid group (e.g., a t-alkyl ester, preferably a t-butyl ester), which together impart high ultraviolet (UV) transparency and developability in basic media to these materials. The materials of this invention have high UV transparency, particularly at short wavelengths, e.g., 157 nm and 193 nm, which makes them useful for lithography at these short wavelengths.

Abstract: Fluorinated polymers, photoresists and associated processes for microlithography are described. These polymers and photoresists are comprised of a fluoroalcohol functional group which simultaneously imparts high ultraviolet (UV) transparency and developability in basic media to these materials. The materials of this invention have high UV transparecy, particularly at short wavelengths, e.g., 157 nm, which makes them highly useful for lithography at these short wavelengths.

Abstract: Nitrile/vinyl ether-containing polymers for photoresist compositions and microlithography methods employing the photoresist compositions are described. These photoresist compositions comprise 1) at least one ethylenically unsaturated compound comprised of a vinyl ether and 2) a nitrile-containing compound, e.g., acrylonitrile, which together impart high ultraviolet (UV) transparency and developability in basic media. In some embodiments, these photoresist compositions further comprise a fluoroalcohol group. The photoresist compositions of this invention have, high UV transparency, particularly at short wavelengths, e.g., 157 nm and 193 nm, which property makes them useful for lithography at these short wavelengths.

Abstract: A flexible, flame-retardant, aqueous processable, photoimageable resin composition for forming a permanent, protective coating film for printed circuitry and a multilayer photoimageable element containing a layer of the photoimageable resin composition in combination with a low tack photoimageable resin sublayer and a temporary support film are disclosed. The photoimageable resin composition has excellent aqueous developability and provides a cured coating film having good flexibility, adhesion, solvent resistance, surface hardness, thermal resistance, electrical insulating properties and flame retardancy.

Abstract: Aqueous processable, photopolymerized coating compositions are disclosed, which after curing, have superior flexibility for use as permanent coatings for the protection of printed circuitry.

Abstract: An aqueous processable, photoimageable element for use as a permanent coating for the protection of printed circuits composed of multiple layers of photoimageable compositions has suffiently low tack to avoid premature adhesion to the printed circuit substrate but develops good adhesion to the circuit substrate upon application of heat and pressure during lamination.