Patents by Inventor Frank Louis Pompeo, Jr.

Frank Louis Pompeo, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6114450
    Abstract: An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: September 5, 2000
    Assignee: International Business Corporation
    Inventors: Krishna Gandhi Sachdev, Michael Berger, Anson Jay Call, Frank Louis Pompeo Jr.
  • Patent number: 5955543
    Abstract: An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin alone and/or a diepoxide resin admixed with a hydroxymethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) which can further contain an electrically or thermally conductive filler.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: September 21, 1999
    Assignee: International Business Machines Corporation
    Inventors: Krishna Gandhi Sachdev, Michael Berger, Anson Jay Call, Frank Louis Pompeo, Jr.