Patents by Inventor Frank M. Desiano
Frank M. Desiano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9743561Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: GrantFiled: June 16, 2016Date of Patent: August 22, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frank M. Desiano, David L. Edwards, Robert K. Mullady, Donald W. Porter, Randy Zoodsma
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Patent number: 9743562Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: GrantFiled: June 16, 2016Date of Patent: August 22, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frank M. Desiano, David L. Edwards, Robert K. Mullady, Donald W. Porter, Randy Zoodsma
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Publication number: 20160295748Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: ApplicationFiled: June 16, 2016Publication date: October 6, 2016Inventors: Frank M. DESIANO, David L. EDWARDS, Robert K. MULLADY, Donald W. PORTER, Randy ZOODSMA
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Publication number: 20160295747Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: ApplicationFiled: June 16, 2016Publication date: October 6, 2016Inventors: Frank M. DESIANO, David L. EDWARDS, Robert K. MULLADY, Donald W. PORTER, Randy ZOODSMA
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Patent number: 9420728Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: GrantFiled: April 15, 2014Date of Patent: August 16, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frank M. Desiano, David L. Edwards, Robert K. Mullady, Donald W. Porter, Randy Zoodsma
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Publication number: 20150296659Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.Type: ApplicationFiled: April 15, 2014Publication date: October 15, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frank M. DESIANO, David L. EDWARDS, Robert K. MULLADY, Donald W. PORTER, Randy ZOODSMA
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Patent number: 6246969Abstract: A method and apparatus for testing cooling units used in computers is presented. Testing of such cooling systems increases the reliability thereof, which in turn increases the reliability of the computers utilizing these cooling systems. The cooling system tester comprises a test frame which supports a plurality of evaporators, associated modular cooling units (units under test) and associated fan or blower assemblies. A heating element is attached to each of these evaporators to act as a heat load for the corresponding modular cooling unit, i.e., to simulate the heat load of an actual computer. The heat output of the heating elements are controlled by a computer. The power supplied to the modular cooling units is also regulated (controlled) by the computer. A program in the computer runs a test on each of the modular cooling units. The program checks for user input and the installation of a modular cooling unit.Type: GrantFiled: September 8, 1998Date of Patent: June 12, 2001Assignee: International Business Machines CorporationInventors: Mark T. Sinclair, Francis G. Cascio, Marc H. Coq, Ronald D. Critelli, Frank M. Desiano, Terrence A. Quinn, Daren Simmons