Patents by Inventor Frank Odell Armstrong

Frank Odell Armstrong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Singulation of wafer level packaging
    Patent number: 11235971
    Abstract: A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: February 1, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Clayton Lee Stevenson, Frank Odell Armstrong
  • SINGULATION OF WAFER LEVEL PACKAGING
    Publication number: 20200231434
    Abstract: A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.
    Type: Application
    Filed: April 6, 2020
    Publication date: July 23, 2020
    Inventors: Clayton Lee Stevenson, Frank Odell Armstrong
  • Singulation of wafer level packaging
    Patent number: 10611632
    Abstract: A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: April 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Clayton Lee Stevenson, Frank Odell Armstrong