Abstract: A universal system for mounting hybrid circuits to printed circuit boards is presented. This universal hybrid mounting system comprises a bottom plate, a frame, a top plate, a heat sink and mounting hardware including a spring. A hybrid circuit package is securely attached to one side of the frame using the top and bottom plates and mounting hardware. The other side of the frame is brought into contact with a printed circuit board (PCB). The PCB comprises a plurality of landing pads which may be gold-plated. The frame comprises a plurality of compliant pins that electrically connect the hybrid to the landing pads of the PCB. The heat sink, in conjunction with the spring, are provided to accommodate high power hybrid packages.