Abstract: A system including a curing system, including a first heating section, wherein the first heating section is configured to heat a device with a first radiant heat source, a second heating section coupled to the first heating section, wherein the second heating section is configured to heat the device with a second radiant heat source, and a controller system, configured to control the first and second heating sections based on a thermal curing profile for the device.

Abstract: A system and method for developing a heat treatment process using a model radiative-heating oven, which repeatably and accurately simulates an industrial heat treatment system. In order to simulate the industrial heat treatment system, the model radiative-heating oven uses a variety of scaling factors, such as heating density parameters. The model radiative-heating oven also may have a quickly openable and closable object carrier, which facilitates a timely start and end of a desired heat treatment process. An oven temperature stabilizer also may be provided for thermally stabilizing the model radiative-heating oven prior to the desired heat treatment process. The present technique also may utilize a variety of heat profile controls, such as time, temperature, and power levels, to provide the desired heat profile in the heat treatment process.