Patents by Inventor Frank Skovgaard-Soerensen

Frank Skovgaard-Soerensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for slicing a multiplicity of wafers from a workpiece
    Patent number: 7827980
    Abstract: A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire gang of a wire saw, with a variable forward feed rate through the wire gang formed by a sawing wire moved with an effective speed, the effective speed of the sawing wire being regulated as a function of the forward feed rate and the workpiece cross section so as to result in uniform wear of the sawing wire.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: November 9, 2010
    Assignee: Siltronic AG
    Inventors: Frank Skovgaard-Soerensen, Matthias Mahnke, Thomas Kasinger
  • Method and device for sawing a workpiece
    Patent number: 7793647
    Abstract: A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a reservoir filled with a sawing suspension, the reservoir being arranged and filled such that at least the part of the sawing wire which is in engagement during the sawing process is immersed into the sawing suspension of the reservoir.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: September 14, 2010
    Assignee: Siltronic AG
    Inventor: Frank Skovgaard-Soerensen
  • Method and Device For Sawing A Workpiece
    Publication number: 20080149085
    Abstract: A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a reservoir filled with a sawing suspension, the reservoir being arranged and filled such that at least the part of the sawing wire which is in engagement during the sawing process is immersed into the sawing suspension of the reservoir.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 26, 2008
    Applicant: SILTRONIC AG
    Inventor: Frank Skovgaard-Soerensen
  • Method For Slicing A Multiplicity Of Wafers From A Workpiece
    Publication number: 20080141994
    Abstract: A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire gang of a wire saw, with a variable forward feed rate through the wire gang formed by a sawing wire moved with an effective speed, the effective speed of the sawing wire being regulated as a function of the forward feed rate and the workpiece cross section so as to result in uniform wear of the sawing wire.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 19, 2008
    Applicant: SILTRONIC AG
    Inventors: Frank Skovgaard-Soerensen, Matthias Mahnke, Thomas Kasinger