Patents by Inventor Frank T. McNally

Frank T. McNally has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for EMI shielding
    Patent number: 7968012
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
  • METHOD AND APPARATUS FOR EMI SHIELDING
    Publication number: 20080283186
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Application
    Filed: March 7, 2008
    Publication date: November 20, 2008
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
  • Method and apparatus for EMI shielding
    Patent number: 6652777
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: November 25, 2003
    Assignee: Amesbury Group, Inc.
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
  • Method and apparatus for EMI shielding
    Publication number: 20010028558
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 11, 2001
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally