Abstract: A polishing jig is provided that is capable of being used with different types, styles, and numbers of optical axes. For example, the polishing jig may be used with a variety of simplex connectors and with duplex connectors of at least first and second types. The first and second types of duplex connectors have different distances between the optical axes of their respective ferrules. The polishing jig may also be used with optical connectors having three or more ferrules having three or more respective optical axes.

Abstract: An optical module includes a housing, an actuator and a fiber clamp having at least one spring member. The actuator and housing are moveable in a sliding manner relative to one another such that the actuator can assume a first actuator position or a second actuator position relative to the housing. The spring member has a first portion in sliding contact with a ramped surface of the actuator and a second portion movable between a first clamp position and a second clamp position in response to sliding movement of the actuator between the first actuator position and second actuator position, respectively. Movement of the second portion of the spring member to the second clamp position reduces a dimension of a fiber passage in the module to frictionally engage an optical fiber in the fiber passage.

Abstract: An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Abstract: An optical module includes a housing, an actuator and a fiber clamp having at least one spring member. The actuator and housing are moveable in a sliding manner relative to one another such that the actuator can assume a first actuator position or a second actuator position relative to the housing. The spring member has a first portion in sliding contact with a ramped surface of the actuator and a second portion movable between a first clamp position and a second clamp position in response to sliding movement of the actuator between the first actuator position and second actuator position, respectively. Movement of the second portion of the spring member to the second clamp position reduces a dimension of a fiber passage in the module to frictionally engage an optical fiber in the fiber passage.

Abstract: An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Abstract: A polishing jig is provided that is capable of being used with different types, styles, and numbers of optical axes. For example, the polishing jig may be used with a variety of simplex connectors and with duplex connectors of at least first and second types. The first and second types of duplex connectors have different distances between the optical axes of their respective ferrules. The polishing jig may also be used with optical connectors having three or more ferrules having three or more respective optical axes.

Abstract: Various embodiments of arrangements for optically coupling an optical waveguide to an optical unit of an optical module are provided. One embodiment is an optical module for optically coupling an optical waveguide to an optical unit. One such optical module comprises: a reference structure having a reference geometry that defines a first axis of symmetry; an optical unit having an optical axis along which light is transmitted or received, the optical unit positioned relative to the reference structure with an offset between the first axis of symmetry and the optical axis; and a coupling element that couples the optical unit to an optical waveguide, the coupling element having an eccentric hole which functions as a fiber guide and a structural geometry adapted to compensate for the offset between the first axis of symmetry and the optical axis.

Abstract: A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

Abstract: Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.

Abstract: The invention relates to an arrangement for optically coupling an optical waveguide to an optical unit of an optical module. The optical module has a reference geometry, which defines a first axis of symmetry. There is an offset between the optical axis of the optical unit and the axis of symmetry of the reference geometry. The invention provides a coupling element which eliminates the offset. The coupling element has, for this purpose, a hole, which is delimited by an inner surface, the inner surface of the coupling element defining a second axis of symmetry. The first axis of symmetry and the second axis of symmetry extend parallel to one another and have an offset with respect to one another which is essentially the same as the offset between the optical axis of the optical unit and the first axis of symmetry of the reference geometry as regards direction and magnitude.

Abstract: The invention relates to a method for producing an optical or electronic module provided with a plastic package. The method includes provision of at least one optical or electronic component, the component having an operative region via which it is in operative connection with the surroundings in the finished module, and application to the component of a protective layer which covers at least the operative region of the component. The method further includes encapsulation of the at least one component with at least one polymer compound to form the package, and partial removal of the polymer compound from the outside by a laser ablation device such that the polymer compound between the protective layer of the component and the outer side of the plastic package is removed. The protective layer is, in this case, not transparent with respect to the radiation emitted by the laser ablation device.

Abstract: One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.

Abstract: A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

Abstract: Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.

Abstract: A metal support or leadframe for the bonding of electrical or optoelectronic components is provided. The leadframe includes a multiplicity of contact legs, that can respectively be connected to one end of a bonding wire for the bonding of a component at a bonding region. At least one electrically nonconducting structure is provided that mechanically interconnects at least two of the contact legs.