Abstract: A constructed photodetector, an optical receiver, and a receiver unit in an optical communication system are disclosed. One example of the disclosed constructed photodetector includes an optoelectronic element having an active area that converts light having a wavelength of interest into electrical signals and a substrate on a face that opposes the active area, where the substrate is non-transparent to light having the wavelength of interest. The constructed photodetector further includes a lens-chip that is at least partially transparent to light having the wavelength of interest, where the lens-chip includes a first side and an opposing second side, where the first side of the lens-chip includes an integrated lens, and where the second side of the lens-chip includes one or more electrical traces. The constructed photodetector further includes at least one connector that provides a physical and electrical connection between the optoelectronic element and the lens-chip.

Abstract: A constructed photodetector, an optical receiver, and a receiver unit in an optical communication system are disclosed. One example of the disclosed constructed photodetector includes an optoelectronic element having an active area that converts light having a wavelength of interest into electrical signals and a substrate on a face that opposes the active area, where the substrate is non-transparent to light having the wavelength of interest. The constructed photodetector further includes a lens-chip that is at least partially transparent to light having the wavelength of interest, where the lens-chip includes a first side and an opposing second side, where the first side of the lens-chip includes an integrated lens, and where the second side of the lens-chip includes one or more electrical traces. The constructed photodetector further includes at least one connector that provides a physical and electrical connection between the optoelectronic element and the lens-chip.

Abstract: In one exemplary embodiment, an optical communications module includes an upper housing portion mated to a lower housing portion with an optical port projecting through an opening in a front surface of the mated assembly. Electronic circuit housed inside the mated assembly can lead to electromagnetic interference (EMI) leakage through a front surface of the mated assembly, especially through the opening that accommodates the optical port. An EMI shield, which is used to address the EMI leakage, includes an annular array of resilient metal fingers that press against a metal flange of the optical port, and also includes at least two peripheral edges each incorporating an array of resilient metal fingers that press against a metal portion of the mated assembly. An interdigital spacing in the annular array and/or the array of resilient metal fingers is defined on the basis of a wavelength associated with the EMI radiation.

Abstract: An optical communications module includes a housing that accommodates at least one optical receptacle having a cylindrical connector portion. The module further includes at least one deformable constraining member made of a material having a Young's modulus that allows the deformable constraining member to take on an initial deformity upon application of a compression force, but permits only a partial reversal of the deformity upon reduction or removal of the compression force. The initial deformity is created when the deformable constraining member is pressed against the cylindrical connector portion during assembly of the module. The initial deformity includes a deformed contour portion that conforms to at least a part of the cylindrical connector portion of the optical receptacle and prevents wiggling of the cylindrical connector portion after the cylindrical connector portion is pushed during assembly into an alignment notch provided in a lower housing portion of the module.

Abstract: Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.

Abstract: An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Abstract: Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.

Abstract: Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.

Abstract: An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Abstract: Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT.

Abstract: Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT.

Abstract: A casing includes a solid sleeve and a split sleeve in combination to provide a connection between a fiber stub and a ferrule containing an optical fiber. The arrangement prevents wiggle of the ferrule, and also does so without the tight tolerances that would otherwise be required in solid sleeve systems.

Abstract: A casing includes a solid sleeve and a split sleeve in combination to provide a connection between a fiber stub and a ferrule containing an optical fiber. The arrangement prevents wiggle of the ferrule, and also does so without the tight tolerances that would otherwise be required in solid sleeve systems.

Abstract: A casing includes a solid sleeve and a split sleeve in combination to provide a connection between a fiber stub and a ferrule containing an optical fiber. The arrangement prevents wiggle of the ferrule, and also does so without the tight tolerances that would otherwise be required in solid sleeve systems.

Abstract: The present invention provides a three cam bail latch system and a method for disconnecting an electronic component from a port using the three cam bail latch system.