Patents by Inventor Franklin E DiPaolo

Franklin E DiPaolo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling system for high density heat load
    Patent number: 9772126
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: September 26, 2017
    Assignee: Liebert Corporation
    Inventors: Steven A. Borror, Franklin E. DiPaolo, Thomas E. Harvey, Steven M. Madara, Reasey J. Mam, Stephen C. Sillato
  • COOLING SYSTEM FOR HIGH DENSITY HEAT LOAD
    Publication number: 20160138840
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Application
    Filed: January 22, 2016
    Publication date: May 19, 2016
    Inventors: Steven A. BORROR, Franklin E. DIPAOLO, Thomas E. HARVEY, Steven M. MADARA, Reasey J. MAM, Stephen C. SILLATO
  • Cooling system for high density heat load
    Patent number: 9243822
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: January 26, 2016
    Assignee: Liebert Corporation
    Inventors: Steven A. Borror, Franklin E. Dipaolo, Thomas E. Harvey, Steven M. Madara, Reasey J. Mam, Stephen C. Sillato
  • Cooling system for high density heat load
    Patent number: 9243823
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: January 26, 2016
    Assignee: Liebert Corporation
    Inventors: Steven A. Borror, Franklin E. DiPaolo, Thomas E. Harvey, Steven M. Madara, Reasey J. Mam, Stephen C. Sillato
  • Cooling system for high density heat load
    Patent number: 8261565
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: September 11, 2012
    Assignee: Liebert Corporation
    Inventors: Steven A Borror, Franklin E DiPaolo, Thomas E Harvey, Steven M Madara, Reasey J Mam, Stephen C Sillato