Abstract: In a device for cooling diode lasers, it is aimed to increase the heat transfer coefficient, with a low overall height of the device, in such a manner that the pressure losses occurring also effectively ensure that stacked heat sinks are operated in parallel in terms of flow. Channels arranged in superimposed planes are divided, in each plane, into groups which are flow-connected in series and, in order to be connected in series, open out into flow-connecting links which are common to the superimposed planes. The device is suitable as a heat sink for diode lasers, in particular for cooling diode laser arrays and stacks thereof.

Abstract: A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.