Abstract: The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10).

Abstract: A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.

Abstract: A method for separating a solid-body layer from a donor substrate includes: providing a donor substrate having a planar surface, a longitudinal axis orthogonal to the planar surface, and a peripheral surface; producing a plurality of modifications within the donor substrate using at least one LASER beam, wherein the at least one LASER beam penetrates the donor substrate via the peripheral surface at an angle not equal to 90° relative to the longitudinal axis of the donor substrate; producing a stress-inducing polymer layer on the planar surface of the donor substrate; and producing mechanical stresses in the donor substrate by a thermal treatment of the stress-inducing polymer layer, wherein the mechanical stresses produce a crack for separating the solid-body layer, and wherein the crack propagates along the modifications.

Abstract: The invention relates to a method for separating solid-body slices (1) from a donor substrate (2).

Abstract: A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.

Abstract: The invention relates to a method for producing a multi-layer assembly.

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The invention relates to a method for separating solid-body slices (1) from a donor substrate (2).

Abstract: The invention relates to a method for producing a multi-layer assembly.

Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Abstract: The present invention relates to a method for producing a multi-component wafer, in particular a MEMS wafer.

Abstract: The present invention relates to the use of compounds with at least one pH-sensitive chemical shift for determining pH and/or measuring pH changes in magnetic resonance. More specifically, the present invention is related to compounds with at least one pH-sensitive chemical shift, such compound being selected from pyruvic acid and its metabolites, compounds produced from pyruvic acid after interaction with acid, and compounds comprising at least one enolic group whose pKa value is lowered through effects of at least one neighboring group into a physiological and/or pathological pH-range, and wherein the compound exhibits at least one pH-sensitive chemical shift in an NMR spectrum. The present invention further relates to biosensors comprising at least one of the compounds. The present invention is furthermore related to in vitro and in vivo methods for determining pH and/or measuring pH changes using the compounds or biosensors.

Abstract: The invention relates to an excimer lamp with a discharge chamber which holds a halogen-containing filling gas forming excimers under discharge conditions. Known excimer lamps have only a short burning life. In order to provide an excimer lamp with a long burning life, it is proposed according to the invention that the halogen content of the discharge chamber be a minimum of 1.times.10.sup.-10 mol/cm.sup.3 volume of the discharge chamber per cm.sup.2 of the discharge chamber interior surface area. To manufacture such a long-life excimer lamp, the interior surfaces of the discharge chamber may be treated with a halogen-containing passivating gas prior to filling in the filling gas or the required amount of halogen can be included in the filing gas.

Abstract: A low-pressure discharge lamp, in particular a deuterium lamp, including a cylindrically symmetric partition unit which forms two hollow spaces at each of the sides of the discharge lamp. Both hollow spaces are connected through an opening in the partition unit, which confines the plasma generated by a high-frequency electromagnetic field to pass through the opening to increase the intensity of the emitted radiation. Both sides of the cylindrically symmetric partition unit are provided with a hermetic seal, at least one of which sides is a radiation emission window. The generation of the electromagnetic field takes place capacitatively through electrodes located on the sides of the discharge lamp. At least one of the electrodes is disposed on the radiation emission exit window and has an opening for the radiation to exit.

Abstract: A low-pressure discharge lamp, in particular a deuterium lamp, includes a lamp envelope in which a plasma for generating UV radiation is formed by the capacitative generation of a high-frequency electromagnetic field. At least two partitions having openings are provided, wherein the openings are disposed on a common optical axis. The openings serve to constrict the plasma contained within the discharge vessel, which provides a high radial intensity of the plasma with high radiation stability for directing radiation along the optical axis. The radiation exits through a radiation emission window which is pervious to UV rays or through two exit windows placed opposite each other along the optical axis. The discharge lamp is particularly suitable for analytic measuring tasks, for example, as a light source in spectrophotometers.

Abstract: An improved machining process using electro-erosion to form integral hinges in rods in making flexible and/or electric suspension blades for various industrial devices.The machining process includes repeatedly eroding a rod alternately on two opposite sides to form two curved indentations, one on each side of the rod at a given point along its length, using a curved cylindrical electrode, so that the rod is progressively narrowed at this point until the required thickness of hinge is obtained. The process may also include, using as reference planes, to position the eroding electrode accurately, surfaces of a frame to which the rods have been attached. In this way, the rods are accurately prepositioned and thin hinges are produced with a repeatable high accuracy.Products made by this process include a pendulum-type accelerometer and an elastic support for a gyroscope useful in aeronautical applications.

Abstract: A pressure vessel, especially as a containment for a nuclear reactor core, comprises a stack of horizontal cast-metal members which define horizontal joints or seams between them, the stack being held together under pre-stress by a multiplicity of tension elements, e.g. cables or rods. The stack is provided with a liner welded together from steel sections and having, in the region of the seams, a reduced thickness as well as a lower yieldability or tensile strength than the yieldability or tensile strength of the liner sections elsewhere. As a result, rupture of the liner is ensured in the region of the seams which constitute preferred pressure release cracks in the event of an explosion or excessive development of pressure within the vessel.