Patents by Inventor Fraser P. Donlan, Jr.

Fraser P. Donlan, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5565040
    Abstract: A new method for treating substrates with fluids, as well as corresponding fluid treatment apparatus. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
    Type: Grant
    Filed: May 4, 1995
    Date of Patent: October 15, 1996
    Assignee: International Business Machines Corporation
    Inventors: Fraser P. Donlan, Jr., David D. Hare, Jeffrey D. Jones, Thomas L. Miller, Ronald J. Moore, Richard F. Nelson
  • Patent number: 5483984
    Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
    Type: Grant
    Filed: August 11, 1992
    Date of Patent: January 16, 1996
    Inventors: Fraser P. Donlan, Jr., David D. Hare, Jeffrey D. Jones, Thomas L. Miller, Ronald J. Moore, Richard F. Nelson
  • Patent number: 5297967
    Abstract: An electrical interconnector for interconnecting two circuit members wherein the interconnector comprises a dielectric member and at least one conductive element. The conductive element includes a base portion retained within the dielectric and at least one projecting helical portion for engaging a conductor of one of the circuit members. Preferably, dendritic elements (e.g., palladium) are formed on the terminal ends of the helical portions for providing debris removal. The form of connection between the helical portion and the conductor is of the non-wiping type. An electrical assembly including this interconnector is also described.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: March 29, 1994
    Assignee: International Business Machines Corporation
    Inventors: John G. Baumberger, Fraser P. Donlan, Jr., James R. Petrozello