Patents by Inventor Fred E. Klimpl

Fred E. Klimpl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5512224
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: April 30, 1996
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5478421
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: September 28, 1993
    Date of Patent: December 26, 1995
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5376326
    Abstract: A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: December 27, 1994
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5037691
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: August 6, 1991
    Assignee: Compositech, Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 4943334
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: September 15, 1986
    Date of Patent: July 24, 1990
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 4526208
    Abstract: A tile-lined pipe and its method of manufacture comprising a tubular pipe member having a layer of tile elements on the inner surface to form a lining therefor. The tile elements extend one after another along helical lines and are formed by subdividing larger tiles transversely along score lines so that the adjoining faces of the subdivided tiles will be in closely conforming adjoining relation. Within the tile elements is an erodible layer. The structure is encompassed by resin saturated fiberglass. The resin serves to absorb energy from impacting particles.
    Type: Grant
    Filed: September 1, 1983
    Date of Patent: July 2, 1985
    Assignee: Koch Engineering Co., Inc.
    Inventor: Fred E. Klimpl
  • Patent number: 4484969
    Abstract: A tile-lined pipe and its method of manufacture comprising a tubular pipe member having a layer of tile elements on the inner surface to form a lining therefor. The tile elements extend one after another along helical lines and are formed by subdividing larger tiles transversely along score lines so that the adjoining faces of the subdivided tiles will be in closely conforming adjoining relation.
    Type: Grant
    Filed: September 29, 1982
    Date of Patent: November 27, 1984
    Assignee: Koch Engineering Co., Inc.
    Inventor: Fred E. Klimpl