Abstract: A substrate support assembly comprises a first optical receiver, a power converter, a first circuit, and a first optical transmitter, all embedded in the substrate support assembly. The first optical receiver is configured to receive a first optical signal and a first optical data through a fiber optic cable. The power converter is configured to generate DC power based on the first optical signal and the first optical data received by the first optical receiver. The first circuit is configured to receive the DC power from the power converter and to receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data. The first optical transmitter is configured to transmit the second data as a second optical data through the fiber optic cable.

Abstract: A substrate support assembly comprises a first optical receiver, a power converter, a first circuit, and a first optical transmitter, all embedded in the substrate support assembly. The first optical receiver is configured to receive a first optical signal and a first optical data through a fiber optic cable. The power converter is configured to generate DC power based on the first optical signal and the first optical data received by the first optical receiver. The first circuit is configured to receive the DC power from the power converter and to receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data. The first optical transmitter is configured to transmit the second data as a second optical data through the fiber optic cable.

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

Abstract: A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

Abstract: A filter for filtering radio frequency (RF) power transmitted from an electrostatic chuck (ESC) in a plasma processing system. The plasma processing system may include a heating element disposed at the ESC. The plasma processing system may further include a power supply. The filter may include a core member and a cable wound around and wound along the core member to form a set of inductors. The cable may include a plurality of wires, including a first wire and a second wire, a portion of the first wire and a portion of the second wire being twisted together, a first end of the first wire and a first end of the second wire being connected to the heating element, each of a second end of the first wire and a second end of the second wire being connected to a capacitor and being connected to the power supply.

Abstract: A filter for filtering radio frequency (RF) power transmitted from an electrostatic chuck (ESC) in a plasma processing system. The plasma processing system may include a heating element disposed at the ESC. The plasma processing system may further include a power supply. The filter may include a core member and a cable wound around and wound along the core member to form a set of inductors. The cable may include a plurality of wires, including a first wire and a second wire, a portion of the first wire and a portion of the second wire being twisted together, a first end of the first wire and a first end of the second wire being connected to the heating element, each of a second end of the first wire and a second end of the second wire being connected to a capacitor and being connected to the power supply.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.