Abstract: In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a first manufacturing process. The system may analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process. The system may automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model.

Abstract: In one embodiment, an automated high-speed X-ray inspection system may identify reference objects for an object of interest to be inspected. Each reference object may have a same type and components as the object of interest. The system may generate a reference model for the object of interest based on X-ray images of the reference objects. The system may determine whether the object of interest is associated with one or more defects by comparing an X-ray image of the object of interest to the reference model. The defects may be characterized by one or more pre-determined defect models and may be classified into respective defect categories based on the pre-determined defect models.

Abstract: In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a first manufacturing process. The system may analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process. The system may automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.