Patents by Inventor Frederick R. Christie

Frederick R. Christie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder interconnection from a composition containing a mixture of dicyanates
    Patent number: 5471096
    Abstract: Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.
    Type: Grant
    Filed: November 4, 1993
    Date of Patent: November 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Kostas I. Papathomas, Frederick R. Christie, David W. Wang
  • Solder interconnection structure
    Patent number: 5250848
    Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
    Type: Grant
    Filed: July 30, 1991
    Date of Patent: October 5, 1993
    Assignee: International Business Machines Corporation
    Inventors: Frederick R. Christie, Kostas I. Papathomas, David W. Wang
  • Dielectric composition and solder interconnection structure for its use
    Patent number: 5194930
    Abstract: Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
    Type: Grant
    Filed: September 16, 1991
    Date of Patent: March 16, 1993
    Assignee: International Business Machines
    Inventors: Kostas Papathomas, Mark D. Poliks, David W. Wang, Frederick R. Christie
  • Method for fabricating metal core layers for a multi-layer circuit board
    Patent number: 5153986
    Abstract: Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias.
    Type: Grant
    Filed: July 17, 1991
    Date of Patent: October 13, 1992
    Assignee: International Business Machines
    Inventors: John M. Brauer, Frederick R. Christie, William H. Lawrence, Ashit A. Mehta, Jonathan D. Reid, William J. Summa
  • Solder interconnection structure and process for making
    Patent number: 5089440
    Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
    Type: Grant
    Filed: December 10, 1990
    Date of Patent: February 18, 1992
    Assignee: International Business Machines Corporation
    Inventors: Frederick R. Christie, Kostas I. Papathomas, David W. Wang
  • Solder interconnection structure and process for making
    Patent number: 4999699
    Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
    Type: Grant
    Filed: March 14, 1990
    Date of Patent: March 12, 1991
    Assignee: International Business Machines Corporation
    Inventors: Frederick R. Christie, Kostas I. Papathomas, David W. Wang
  • Bismaleimide triazine composition
    Patent number: 4456712
    Abstract: A composition suitable for making circuit boards containing a bismaleimide triazine polymeric component, a brominated epoxy polymeric component, and a solvent is provided.
    Type: Grant
    Filed: April 26, 1983
    Date of Patent: June 26, 1984
    Assignee: International Business Machines Corporation
    Inventors: Frederick R. Christie, Lawrence R. Daley