Patents by Inventor Frederick Richard Christie

Frederick Richard Christie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder interconnection structure and process for making
    Patent number: 5668059
    Abstract: Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: September 16, 1997
    Assignee: International Business Machines Corporation
    Inventors: Frederick Richard Christie, Kostas I. Papathomas, David Wei Wang