Abstract: A thermal filter is provided within a vehicle lamp assembly for reducing thermal radiation from reaching selected portions of the lamp assembly from an illumination light source disposed within the vehicle lamp. The thermal filter includes an inner envelope and an outer envelope in spaced relation to the inner envelope. The inner envelope and the outer envelope define a closed chamber therebetween. The closed chamber being disposed between the illumination light source and the selected portions of the lamp assembly. The inner envelope includes an interior portion. A thermal radiation absorbing agent disposed within the closed chamber. The thermal radiation absorbing agent receives radiation emitted from the illumination source. The thermal radiation absorbing agent is transparent to short wave visible radiation and is substantially opaque to long wave infrared radiation. A substantial portion of the long wave infrared radiation absorbed by the absorbing agent is retained within the closed chamber.

Abstract: A thermal filter is provided within a vehicle lamp assembly for reducing thermal radiation from reaching selected portions of the lamp assembly from an illumination light source disposed within the vehicle lamp. The thermal filter includes an inner envelope and an outer envelope in spaced relation to the inner envelope. The inner envelope and the outer envelope define a closed chamber therebetween. The closed chamber being disposed between the illumination light source and the selected portions of the lamp assembly. The inner envelope includes an interior portion. A thermal radiation absorbing agent disposed within the closed chamber. The thermal radiation absorbing agent receives radiation emitted from the illumination source. The thermal radiation absorbing agent is transparent to short wave visible radiation and is substantially opaque to long wave infrared radiation. A substantial portion of the long wave infrared radiation absorbed by the absorbing agent is retained within the closed chamber.

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Abstract: A patient physiological parameter monitoring apparatus for a subject includes a sensor assembly having at least one responsive element that produces a first signal upon detection of a change in temperature. The assembly also includes a converter for converting the first signal into an electrical signal, and a transmitter for wirelessly transmitting converted electrical signals upon demand based upon receipt of a transmitted signal from an interrogation device. Preferably, at least a portion of the sensor assembly is disposable to permit single use or single subject use and can be further used to track location and information of medical equipment in addition to subjects.

Abstract: A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

Abstract: A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Abstract: An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly.

Abstract: An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50.

Abstract: A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.