Abstract: Mechanism for soldering seams, especially the side seams of moving "tin" can bodies, comprises means for guiding each seam along a path, an applicator rotatable counter to the direction of can seam travel and having one portion immersed in molten solder and another solder wettable portion not so immersed, the other portion including a solder applying rim in substantially tangential relation to a locality of the seam joint in the path, and means for maintaining an atmosphere of inert gas about the non-immersed applicator portion and the mentioned locality to avoid oxidation of the solder as applied at the joint and also while carried thereto by the applicator.

Abstract: An improved machine and method for stiffening a selected portion of a sheet-like member generally flattens that portion, next deposits on a chill plate matrix an adhesive hot melt deposit of mostly uniform thickness except for a margin of added thickness for slower hardening, and then causes the matrix with impact to press all of the adhesive, while the added thickness margin is still softer than the uniform adhesive thickness, against the flattened portion of the member, thus transferring the adhesive to that portion, the added thickness margin being exuded laterally and hence taperingly reduced to provide diminishing stiffness toward an edge merging with the member.The machine and method have particular advantage in stiffening a toe portion of a shoe upper, rendering the instep margin of the vamp or a toe piece free of irregularity, and assuring ultimate comfort for wearing in an assembled shoe.