Patents by Inventor Frederik Schrey

Frederik Schrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having at least one contact, and manufacturing method for a semiconductor device having at least one contact
    Patent number: 9202702
    Abstract: A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: December 1, 2015
    Assignee: ROBERT BOSCH GMBH
    Inventors: Frederik Schrey, Achim Trautmann, Joachim Rudhard
  • Electronic component
    Patent number: 8698319
    Abstract: An electronic component includes a printed conductor structure on a substrate, as well as a film which contacts the printed conductor structure. The film has a smaller layer thickness than the printed conductor. The printed conductor structure has a region which is covered by the film for the purpose of contacting.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: April 15, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Richard Fix, Frederik Schrey, Oliver Wolst, Ingo Daumiller, Alexander Martin, Martin Le-Huu, Mike Kunze
  • SEMICONDUCTOR DEVICE HAVING AT LEAST ONE CONTACT, AND MANUFACTURING METHOD FOR A SEMICONDUCTOR DEVICE HAVING AT LEAST ONE CONTACT
    Publication number: 20120292641
    Abstract: A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.
    Type: Application
    Filed: April 13, 2012
    Publication date: November 22, 2012
    Inventors: Frederik Schrey, Achim Trautmann, Joachim Rudhard
  • Electronic component
    Publication number: 20110272747
    Abstract: An electronic component includes a printed conductor structure on a substrate, as well as a film which contacts the printed conductor structure. The film has a smaller layer thickness than the printed conductor. The printed conductor structure has a region which is covered by the film for the purpose of contacting.
    Type: Application
    Filed: November 17, 2009
    Publication date: November 10, 2011
    Inventors: Richard Fix, Frederik Schrey, Oliver Wolst, Ingo Daumiller, Alexander Martin, Martin Le-Huu, Mike Kunze