Abstract: The invention relates to a method of manufacturing a semiconductor device with a pn junction, whereby an epitaxial layer (2) with a first zone (3) of a first conductivity type and with a second zone (4) of a second conductivity type opposed to the first is provided on a silicon substrate (1), a pn junction (5) being formed between the second and first zones (3, 4, respectively). According to the invention, the method is characterized in that the epitaxial layer (2) is provided by means of a CVD process at a temperature below 800.degree. C., the epitaxial layer (2) being provided in that first the first zone (3) and then the second zone (4) are epitaxially provided on the substrate (1), while no heat treatments at temperatures above 800.degree. C. take place after the epitaxial layer (2) has been provided.

Abstract: The invention relates to a method of manufacturing a varicap diode whereby a silicon substrate with an epitaxial layer of a first conductivity type is provided with a first zone through the provision of dopant atoms of a first conductivity type in the epitaxial layer and is provided with a second zone adjoining a surface of the epitaxial layer through the provision of dopant atoms of a second conductivity type opposed to the first in the epitaxial layer, a pn junction being formed between the second zone and the first zone. According to the invention, the method is characterized in that the second zone is provided in that a layer of polycrystalline silicon provided with dopant atoms of the second conductivity type is provided on the surface, and in that the dopant atoms are diffused from this layer into the epitaxial layer, whereby a pn junction is formed at a distance of less than 0.3 .mu.m from the polycrystalline silicon.

Abstract: Semiconductor device and method of manufacturing same, display device and support plate for same provided with such a semiconductor device. A semiconductor device having an insulating substrate on which a Schottky diode is formed between a metal layer and a semiconductor layer of polycrystalline or amorphous silicon extending over the metal layer is used inter alia in matrix display devices, such as LCDs. The Schottky diode forms part of a switching element of such a device and must have a low reverse current up to a reverse voltage of, for example, approximately 10 V. The known semiconductor device having Schottky diodes, in which the semiconductor material extends over a lateral surface of the Schottky metal, is found not to comply with this requirement. To overcome this deficiency a low leakage current is realized over a wide reverse voltage range due to the presence of a dielectric on the lateral surface of the Schottky metal. The dielectric suppresses the leakage current issuing from the lateral surface.

Abstract: By arranging a Schottky diode so that it is sensitive to grazing light only in the back-bias mode, a switching element is obtained which, when used in, for example an active matrix LCD display, has a current-voltage characteristic which is comparable to that of a zener diode and can be driven in a reset mode.

Abstract: An a:Si diode (7) for use in LCDs is located between two metal contacts (10, 15) which extend throughout the diode surface. This reduces the detrimental effect due to the light sensitivity of (amorphous) silicon. A MIM element (8) parallel to the diode (7) is obtained by having the metal contacts project further and by providing a thin layer of insulating material (13, 19) between these contacts.

Abstract: For satisfactory operation of a display arrangement having an electro-optical display medium and picture elements arranged between row and column electrodes and connected in series with an anti-parallel arrangement of PIN diodes, the diodes should have a small reverse current notwithstanding any ambient radiation present. In a display arrangement according to the invention, a small photo-current in the reverse direction is obtained due to the fact that the i-region and the p- or n-type region do not adjoin each other directly in the proximity of the edge of the mesa-shaped PIN diode. The region within which the aforementionhed regions adjoin each other is preferably located at a distance from the edge of the mesa-shaped PIN diode amounting to at least once the penetration depth of the ambient radiation plus the diffusion length of charge carriers in the i-region.