Abstract: Patterned dies made of non-conductive resins may be equipped with integrated electrodes in different manners. It is proved to be difficult to produce high-quality electrodes especially in microstructured dies. A patterned plastic die arranged on a carrier plate is filled with a solution of a metal compound. This solution is irradiated through the carrier plate from the back side of the carrier plate using laser light, ultraviolet light or X-rays. The metal compound is transformed in the immediate vicinity of the base of the structure and a metal layer is deposited on the base of the structure forming the electrodes. The method is suitable for a base of the structure forming a coherent or a non-coherent area. Plastic dies containing integrated electrodes are used for electroless or electrophoretic deposition of materials and for electroplating, in all cases starting from the integrated electrodes, and for analytical methods.

Abstract: The present invention concerns stepped mould inserts, a method of producing the same and high-precision stepped microstructure bodies moulded therewith. The present stepped mould inserts and method of producing the same are more simple than previous methods. The lithographically produced regions of a patterned resist layer, which are exposed by development on a flat plate, are filled with metal. The layer may be mechanically removed, down to a predetermined thickness. After the residues of the resist have been dissolved out, if necessary or desired, this operation is repeated from one to several times. The regions removed from the resist layer are filled with metal, covered and separated from the resist layer, thus providing a multistep metallic mould insert. High-precision microstructure bodies having a multistep structure are produced with the present stepped mould insert.