Abstract: A method detects the electrical topology of a supply network. The network includes at least one power supply unit, a control unit, at least one field bus device, and at least one measuring device. The field bus devices are supplied by the power supply unit. The measuring device is a smart connector, a field bus device, and/or an operating value sensor integrated in the power supply unit or connected thereto. A load is a field bus device and/or another device presenting a load. The method includes a) activating a load to generate an operating signal, b) receiving the operating signal and/or a time profile of the operating signal, c) detecting the operating value, d) evaluating the detection data from the operating signal, and e) applying an algorithm to determine the topology of the supply network. A control unit includes hardware and software to carry out the method.

Abstract: A further field device is configured to interact with a field device having a storage device storing a configuration of at least the further field device. The field device is configured to output the configuration to the further field device and/or to receive the configuration from the further field device. The further field device is furthermore configured to receive and/or to store the configuration from the field device, in order to match the configuration received from the field device to its technical design.

Abstract: A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.

Abstract: A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.

Abstract: A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.

Abstract: A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.

Abstract: The invention relates to a method with which proteins from formalin-fixed biological samples can be dissolved and subsequently quantified. The method makes it possible to extract intact full-length proteins from the samples and to conduct a subsequent analysis thereof.

Abstract: The invention relates to a method with which proteins from formalin-fixed biological samples can be dissolved and subsequently quantified. The method makes it possible to extract intact full-length proteins from the samples and to conduct a subsequent analysis thereof.

Abstract: The invention relates to a mobile radio receiver comprising a receiving device (22, 19) for receiving time reference signals.

Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.

Abstract: Circuit comprising a signal input (IN) for receiving an input signal s(t) and a digital input stage (15) being designed for operation at a supply voltage (VDD). The input stage (15) comprises CMOS transistors, which are sensitive to voltages across transistor nodes going beyond a voltage limit (Vmax), and an input (IINV). Voltage limiting means (B) being are arranged between the signal input (IN) and the input (IINV). The voltage limiting means (B) comprise an input switch (ns) being controllable by the state of the input signal s(t), and limit voltages at the input (IINV) to the supply voltage (VDD). In addition, means for over-voltage protection (A) are provided between the signal input (IN) and the supply voltage (VDD). The means for over-voltage protection (A) comprise at least one active circuit element being arranged so as to mimic part of a zener function.

Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.

Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection and therapy of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas as well as methods for the detection and therapy of diffuse gastric carcinomas.

Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection and therapy of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas as well as methods for the detection and therapy of diffuse gastric carcinomas.

Abstract: The present invention describes monoclonal antibodies which are useful for the specific detection of diffuse gastric carcinoma. Further embodiments describe therapeutic and diagnostic means for the detection and for the therapy of diffuse gastric carcinomas.