Abstract: The yarn feeding device for a yarn-consuming textile machine includes a mechanism for positively feeding yarn to a textile machine according to predetermined yarn consuming speed changes and timings of those changes, this mechanism having a rotary yarn feeding element (1,83) carrying a main yarn reserve (84), a motor (82) for rotating the yarn feeding element (1,83) at a motor rotation speed according to the variable yarn consuming speed and a motor controller (51, 57) for controlling the motor; a yarn reserve device (3,78; 20, 77) for building up or reducing an auxiliary yarn reserve consisting of a portion of yarn extending between the main yarn reserve and the textile machine, when changes in the yarn consuming speed occur that are so rapid that the motor (82) temporarily cannot change the motor rotation speed to deliver yarn from the rotary yarn feeding element at the yarn consuming speed because of motor inertia; a controller for the yarn reserve device (3,78; 20,77) which increases or decreases the auxi

Abstract: In a yarn feeder (2), the yarn feed may be effected by a yarn reserve (11) support spool (2), which is arranged to rotate by means of a motor (60). The yarn is taken up by and unwound from the spool as the latter rotates. Unwinding of the yarn reserve on the spool is not controlled. The size of the yarn reserve is monitored and yarn take-up is controlled accordingly. The unit also includes electrically contactless sensing and control devices (3), which are preferably located immediately adjacent to the rotary spool. The unit (3) is designed to sense the presence and quantity of yarn on the yarn reserve support surface (10) of the spool. The unit also controls the said motor.

Abstract: Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made from a metal that can readily be connected with the electrodes of the semi-conductor, such as nickel. The thin feed lines extend from the outer support and connection legs and are made from a different metal that can readily be soldered, such as brass and have conductive contact with said legs. The inner feed lines and carrier are made by an etching process. The inner feed lines supporting the semi-conductor are resilient, and by their resiliency balance thermal expansion between the semi-conductor substrate and the coarse structure of the connection legs of the system carrier.