Abstract: A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.

Abstract: The invention relates to a method for producing a measuring transducer in order to transform at least one physical variable into at least one electric variable. According to the invention, a plurality of planar, insulating and conductive layers (21-26 and 11-17) are respectively structured according to predefineable models which are adapted to each other and which are assembled in order to form a multi-layered arrangement.

Abstract: An optoelectronic assembly having components designed to be fabricated on a stamping process capable of producing parts having tolerances below 1000 nanometers. The optoelectronic assembly includes ferrules and sleeves. The ferrules can include two identical half ferrules that are forged and assembled together to form the ferrule body. The ferrules can also be designed to be alternatively produced by forming processes or produced by a combination of forging and forming processes. The pair of ferrules supporting one or more optical fibers are guided together by a high precision split sleeve for coupling the fibers together.

Abstract: An optoelectronic assembly having components designed to be fabricated on a stamping process capable of producing parts having tolerances below 1000 nanometers. The optoelectronic assembly includes ferrules and sleeves. The ferrules can include two identical half ferrules that are forged and assembled together to form the ferrule body. The ferrules can also be designed to be alternatively produced by forming processes or produced by a combination of forging and forming processes. The pair of ferrules supporting one or more optical fibers are guided together by a high precision split sleeve for coupling the fibers together.

Abstract: A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.

Abstract: An improved support structure is provided in a method for making objects by the incremental build-up of layers of a deposition material and adjacent support material. The improved support structure includes a first material and a second material placed as a coating upon the first material. The deposition material, first material and second material each preferably have a selected melting point such that the first material melting point is lower than the deposition material melting point and such that the second material melting point is greater than the first material melting point.