Abstract: A semiconductor package and method of forming the package, including a substrate having an opening formed therein. Contact pads are formed about a periphery of the opening on a first side of the substrate and a second opposing side of the substrate. A flip chip die is mounted to the substrate, having an active side mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract: A semiconductor package (100, 150, 200, 250), and method of forming the package, including a substrate (102, 102?, 202, 202?) having an opening (104, 104?, 204, 204?) formed therein. Contact pads (112, 112?, 212, 212?) are formed about a periphery of the opening on a first side of the substrate (106, 106?, 206, 206?) and a second opposing side (132, 132?, 232, 232?) of the substrate. A flip chip die (120, 120?, 220, 220?) is mounted to the substrate, having an active side (114, 114?, 214, 214?) mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die (110, 110?, 210, 210?) is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract: A semiconductor device (20) includes an integrated circuit (22) having a plurality of bonding pads (24) located on a peripheral portion of its top surface and a groove (26) formed in its bottom surface (28). The groove (26) extends from one end to an opposite end of the IC (22). Lead fingers (30) that surround the IC (22) are electrically connected to respective ones of the bonding pads (24) via wirebonding. A mold compound (34) covers the top surfaces of the IC (22) and the lead fingers (30), and the electrical connections. At least the bottom surfaces of the lead fingers (30) and the IC (22) are exposed, except for the groove (26), which is filled with the mold compound (34).