Abstract: Three-dimensional neural network array. In an exemplary embodiment, a three-dimensional (3D) neural network includes a plurality of input conductors forming a plurality of stacked input layers having a first orientation, and at least one output conductor forming an output layer having the first orientation. The three-dimensional (3D) neural network also includes a plurality of hidden conductors having a second orientation. Each hidden conductor includes an in-line threshold element. The three-dimensional (3D) neural network also includes synapse elements coupled between the hidden conductors and the input conductors and between the hidden conductors and the output conductor. Each synapse element includes a programmable resistive element.

Abstract: A high-density neural network array. In an exemplary embodiment, an apparatus includes a three-dimensional (3D) structure having a plurality of layers forming a neural network. Each layer comprises one or more conductors forming neurons with each neuron having neuron inputs and neuron outputs. The apparatus also includes synapse elements coupled between the neurons outputs and the neuron inputs of neurons in adjacent layers. Each synapse element comprises a material that applies a selected weight to signals passing between neurons connected to that synapse element.

Abstract: A SONOS byte-erasable EEPROM is disclosed. In one aspect, an apparatus includes a plurality of SONOS memory cells forming an EEPROM memory array. The apparatus also includes a controller that generates bias voltages to program and erase the memory cells. The controller performs a refresh operation when programming selected memory cells to reduce write-disturb on unselected memory cells to prevent data loss.

Abstract: A memory device includes a static random-access memory (“SRAM”) circuit and a first nonvolatile memory (“NVM”) string, a second NVM string, a first and a second drain select gates (“DSGs”). The SRAM circuit is able to temporarily store information in response to bit line (“BL”) information which is coupled to at the input terminal of the SRAM circuit. The first NVM string having at least one nonvolatile memory cell is coupled to the output terminal of the SRAM. The first DSG is operable to control the timing for storing information at the output terminal of the SRAM to the first nonvolatile memory. The second NVM string having at least one nonvolatile memory cell is coupled to the output terminal of the SRAM. The second DSG controls the timing for storing information at the output terminal of the SRAM to the second nonvolatile memory string.

Abstract: A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a drain P+ diffusion deposited in the N? well, a source P+ diffusion deposited in the N? well, and an oxide layer deposited on the N? well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.

Abstract: A memory device is able to store data using both on-chip dynamic random-access memory (“DRAM”) and nonvolatile memory (“NVM”). The memory device, in one aspect, includes NVM cells, word lines (“WLs”), a cell channel, and a DRAM mode select. The NVM cells are capable of retaining information persistently and the WLs are configured to select one of the NVM cells to be accessed. The cell channel, in one embodiment, is configured to interconnect the NVM cells to form a NVM string. The DRAM mode select can temporarily store data in the cell channel when the DRAM mode select is active.

Abstract: A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a drain P+ diffusion deposited in the N? well, a source P+ diffusion deposited in the N? well, and an oxide layer deposited on the N? well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.

Abstract: A memory device is able to store data using both on-chip dynamic random-access memory (“DRAM”) and nonvolatile memory (“NVM”). The memory device, in one aspect, includes NVM cells, word lines (“WLs”), a cell channel, and a DRAM mode select. The NVM cells are capable of retaining information persistently and the WLs are configured to select one of the NVM cells to be accessed. The cell channel, in one embodiment, is configured to interconnect the NVM cells to form a NVM string. The DRAM mode select can temporarily store data in the cell channel when the DRAM mode select is active.

Abstract: A dual function hybrid memory cell is disclosed. In one aspect, the memory cell includes a substrate, a bottom charge-trapping region formed on the substrate, a top charge-trapping region formed on the bottom charge-trapping region, and a gate layer formed on the top charge trapping region. In another aspect, a method for programming a memory cell having a substrate, a bottom charge-trapping layer, a top charge-trapping layer, and a gate layer is disclosed. The method includes biasing a channel region of the substrate, applying a first voltage differential between the gate layer and the channel region, injecting charge into the bottom charge-trapping layer from the channel region based on the first voltage differential. The method also includes applying a second voltage differential between the gate layer and the channel region and injecting charge from the bottom charge-trapping layer into the top charge-trapping layer based on the second voltage differential.

Abstract: A two transistor SONOS flash memory is disclosed. In one aspect, an apparatus, includes a control gate transistor having source and drain diffusions deposited in an N-well, a charge-trapping region formed on the N-well that overlaps the source and drain diffusions, and a control gate formed on the charge-trapping region. A channel region of the N-well between the source and drain diffusions is less than 90 nm in length. The apparatus also includes a select gate transistor having a select source diffusion deposited in the N-well. A drain side of the select gate transistor shares the source diffusion. A channel region of the N-well between the select source diffusion and the source diffusion also is less than 90 nm in length.

Abstract: A compact CMOS anti-fuse memory cell. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a lightly doped drain (LDD) region deposited in the N? well, an oxide layer deposited on the N? well and having an overlapping region that overlaps the LDD region, and a control gate deposited on the oxide layer, wherein a bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the LDD region exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the LDD region, and wherein the leakage path is confined to occur in the overlapping region.

Abstract: Three-dimensional cross-point array and process flows. In an exemplary embodiment, a method is provided that includes forming stacked layers, performing a first lithography operation on the stacked layers to form cell columns, and performing a second lithography operation on the stacked layers to form first vertical openings that are filled with first conductor layers to form one or more word line connections in a first direction. The method also includes performing a third lithography operation on the stacked layers to form second vertical openings that are filled with second conductor layers to form one or more bit line connections in a second direction.

Abstract: A 3D array inside a substrate trench. In one aspect, an apparatus includes a substrate, a trench region in the substrate that is defined by a trench wall, and a 3D array having stacked word line layers formed in the trench region that follow a contour of the trench wall. In one aspect, a method includes forming a trench region in a substrate that has a top surface, the trench region is defined by a trench wall, and forming a 3D array having stacked word line layers in the trench region so that the stacked word line layers follow a contour of the trench wall and have exposed ends substantially at a level of the top surface.

Abstract: Three-dimensional vertical memory array cell structures and processes. In an exemplary embodiment, a cell structure includes a word line, a selector layer, and a memory layer. The word line, the selector layer, and the memory layer form a vertical cell structure in which at least one of the selector layer and the memory layer are segmented to form a segment that blocks sneak path leakage current on the word line.

Abstract: A 3D NAND array with divided string architecture. In one aspect, an apparatus includes a plurality of charge storing devices connected to form a cell string. The apparatus also includes one or more internal select gates connected between selected charge storing devices in the cell string. The one or more internal select gates divide the cell string into two or more segments of charge storing devices. Selectively enabling and disabling the one or more internal select gates during programming operates to isolate one or more selected segments to reduce program-disturb to remaining segments. In another embodiment, a method is provided for programming a memory cell of a cell string having internal select gates that isolate the memory cell to reduce the effects of program-disturb. In another embodiment, multiple memory cells of a cell string having internal select gates are programmed with reduced program-disturb.

Abstract: A three-dimensional double-density NAND flash memory device is disclosed. In one aspect, an apparatus includes a three dimensional stacked configuration of word line layers separated by insulating layers. The stacked configuration includes a selected number of the word line layers. The apparatus also includes an array of NAND strings deposited within the stacked configuration and perpendicular to a top surface of the stacked configuration. Each NAND string includes a charge-trapping layer that extends through the selected number of word line layers. The apparatus also includes one or more slits through the stacked configuration that divide each word line layer into a plurality of word line regions. The charge-trapping layer of each NAND string is coupled to two word line regions in each word line layer to form two charge-trapping regions to store two data bits in each word line layer.

Abstract: A dual function hybrid memory cell is disclosed. In one aspect, the memory cell includes a substrate, a bottom charge-trapping region formed on the substrate, a top charge-trapping region formed on the bottom charge-trapping region, and a gate layer formed on the top charge trapping region. In another aspect, a method for programming a memory cell having a substrate, a bottom charge-trapping layer, a top charge-trapping layer, and a gate layer is disclosed. The method includes biasing a channel region of the substrate, applying a first voltage differential between the gate layer and the channel region, injecting charge into the bottom charge-trapping layer from the channel region based on the first voltage differential. The method also includes applying a second voltage differential between the gate layer and the channel region and injecting charge from the bottom charge-trapping layer into the top charge-trapping layer based on the second voltage differential.

Abstract: A SONOS byte-erasable EEPROM is disclosed. In one aspect, an apparatus includes a plurality of SONOS memory cells forming an EEPROM memory array. The apparatus also includes a controller that generates bias voltages to program and erase the memory cells. The controller performs a refresh operation when programming selected memory cells to reduce write-disturb on unselected memory cells to prevent data loss.

Abstract: A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a drain P+ diffusion deposited in the N? well, a source P+ diffusion deposited in the N? well, and an oxide layer deposited on the N? well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.

Abstract: A two transistor SONOS flash memory is disclosed. In one aspect, an apparatus, includes a control gate transistor having source and drain diffusions deposited in an N-well, a charge-trapping region formed on the N-well that overlaps the source and drain diffusions, and a control gate formed on the charge-trapping region. A channel region of the N-well between the source and drain diffusions is less than 90 nm in length. The apparatus also includes a select gate transistor having a select source diffusion deposited in the N-well. A drain side of the select gate transistor shares the source diffusion. A channel region of the N-well between the select source diffusion and the source diffusion also is less than 90 nm in length.