Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A federated learning method includes: providing importance parameters and performance parameters by client devices respectively to a central device, performing a training procedure by the central device, wherein the training procedure includes: selecting target devices from the client devices according to a priority order associated with the importance parameters, dividing the target devices into training groups according to a similarity of the performance parameters, notifying the target devices to perform iterations according to the training groups respectively to generate trained models, transmitting the trained models to the central device, and updating a global model based on the trained models, performing the training procedure again or outputting the global model to the client devices based on a convergence value of the global model and the number of times of performing the training procedure.

Abstract: A system and method for wafer-level inspection using on-valve inspection detectors to detect defects on a semiconductor wafer surfaces during a semiconductor device manufacturing process is disclosed herein. In some exemplary embodiments, a method for wafer-level inspection includes: transporting a semiconductor wafer through a transfer port of a processing chamber; scanning a surface of the semiconductor wafer automatically using at least one on-valve inspection detector arranged on a vacuum valve providing access through the transfer port; generating at least one surface image of the surface of the semiconductor wafer; and analyzing the at least one surface image to detect defects on the surface of the semiconductor wafer.

Abstract: A projection screen includes a substrate, a plurality of prism structures, and a plurality of light absorbing structures. The substrate includes a first surface adjacent to the projector and a second surface away from the projector. The prism structures are disposed on the first surface, and each of the prism structures includes a first inclined surface, a second inclined surface, and a bottom surface. The first inclined surface is configured to receive and reflect projection light beams. There is a first angle between the first inclined surface and the bottom surface, and a second angle between the second inclined surface and the bottom surface. The first angle is less than or equal to the second angle. The light absorbing structures are respectively disposed on at least a portion of the second inclined surface of each of the prism structures. The light absorbing structures are configured to absorb ambient light.

Abstract: A rear projection screen includes a prism film, a first diffusion layer, a second diffusion layer and a light absorbing film sequentially disposed along a first direction. The prism film includes a first light-transmitting substrate and prism structures, wherein the prism structures are disposed on a surface of the first light-transmitting substrate away from the first diffusion layer. The prism structures receive an image beam and guide the image beam to be transmitted along the first direction. The first diffusion layer and the second diffusion layer have different refractive indexes. There are light-absorbing structures disposed in the light absorbing film, and the light-absorbing structures are arranged spaced apart from each other.

Abstract: A projection screen including a light absorbing film and a projection film is provided. The light absorbing film includes a transparent layer and a plurality of light absorbing microstructures, where the light absorbing microstructures are embedded in the transparent layer and arranged at intervals, each of the light absorbing microstructures is asymmetrical to a reference plane, the transparent layer has two surfaces opposite to each other, and the reference plane passes through a geometric center of each of the light absorbing microstructures and is parallel to each of the surfaces, and there is a space between each of the light absorbing microstructures and each of the surfaces. The projection film and the light absorbing film are stacked on each other. A light absorbing film is also provided, and the projections screen and the light absorbing film have good optical quality.

Abstract: A writable projection screen includes a substrate, a reflective layer and a writing layer. The reflective layer is disposed on the substrate, and the writing layer has a light receiving surface. The light receiving surface is adapted to receive a projection light beam. A roughness of the light receiving surface is between 5 ?m and 30 ?m. The substrate is disposed between the reflective layer and the writing layer, or the reflective layer is disposed between the substrate and the writing layer. The writable projection screen has good quality for displaying an image and can be used for being written by a variety of pens.

Abstract: A projection screen includes a substrate, a plurality of prism structures, and a plurality of light absorbing structures. The substrate includes a first surface adjacent to the projector and a second surface away from the projector. The prism structures are disposed on the first surface, and each of the prism structures includes a first inclined surface, a second inclined surface, and a bottom surface. The first inclined surface is configured to receive and reflect projection light beams. There is a first angle between the first inclined surface and the bottom surface, and a second angle between the second inclined surface and the bottom surface. The first angle is less than or equal to the second angle. The light absorbing structures are respectively disposed on at least a portion of the second inclined surface of each of the prism structures. The light absorbing structures are configured to absorb ambient light.

Abstract: A rear projection screen includes a transparent substrate, a light absorbing film and a first diffusion film in sequence from a projection side to a viewer side. The transparent substrate includes a first surface and a second surface opposite to each other, the first surface faces the projection side, the second surface faces the viewer side, and the first surface is disposed with a plurality of prism structures protruding toward the projection side. The transparent substrate is located between the light absorbing film and the prism structures. The light absorbing film includes a plurality of light absorbing structures arranged at intervals from each other, and the distribution density of the prism structures is greater than that of the light absorbing structures. The light absorbing film is located between the first diffusion film and the transparent substrate. The rear projection screen through the above-mentioned design has a good image display quality.

Abstract: A rear projection screen includes a prism film, a first diffusion layer, a second diffusion layer and a light absorbing film sequentially disposed along a first direction. The prism film includes a first light-transmitting substrate and prism structures, wherein the prism structures are disposed on a surface of the first light-transmitting substrate away from the first diffusion layer. The prism structures receive an image beam and guide the image beam to be transmitted along the first direction. The first diffusion layer and the second diffusion layer have different refractive indexes. There are light-absorbing structures disposed in the light absorbing film, and the light-absorbing structures are arranged spaced apart from each other.

Abstract: A projection screen including a light absorbing film and a projection film is provided. The light absorbing film includes a transparent layer and a plurality of light absorbing microstructures, where the light absorbing microstructures are embedded in the transparent layer and arranged at intervals, each of the light absorbing microstructures is asymmetrical to a reference plane, the transparent layer has two surfaces opposite to each other, and the reference plane passes through a geometric center of each of the light absorbing microstructures and is parallel to each of the surfaces, and there is a space between each of the light absorbing microstructures and each of the surfaces. The projection film and the light absorbing film are stacked on each other. A light absorbing film is also provided, and the projections screen and the light absorbing film have good optical quality.

Abstract: A rear projection screen includes a transparent substrate, a light absorbing film and a first diffusion film in sequence from a projection side to a viewer side. The transparent substrate includes a first surface and a second surface opposite to each other, the first surface faces the projection side, the second surface faces the viewer side, and the first surface is disposed with a plurality of prism structures protruding toward the projection side. The transparent substrate is located between the light absorbing film and the prism structures. The light absorbing film incudes a plurality of light absorbing structures arranged at intervals from each other, and the distribution density of the prism structures is greater than that of the light absorbing structures. The light absorbing film is located between the first diffusion film and the transparent substrate. The rear projection screen through the above-mentioned design has a good image display quality.

Abstract: A projection screen, adapted to receive an image beam, includes a transparent substrate, optical pillar structures, a light-scattering layer, Fresnel structures and a light-absorption layer. The transparent substrate has first surface and second surface opposing to each other. The optical pillar structures are located at the first surface, and between the light-scattering layer and the transparent substrate. Each optical pillar structure is arranged along the first direction. The Fresnel structures are located at the second surface, and disposed between the transparent substrate and the light-absorption layer. Each Fresnel structure has a reflective surface and a transmissive surface connected to the reflective surface. The image beam sequentially passes through the light-scattering layer, the optical pillar structures, the transparent substrate and travels to the reflective surfaces, and the image beam is reflected by the reflective surfaces and outputs from the projection screen.

Abstract: A projection screen including a substrate, Fresnel structures and a protective layer is provided. The Fresnel structures are located on a surface of the substrate facing an image-source side and arranged along a first direction. Each Fresnel structure extends along a second direction. The protective layer has a first surface facing the image-source side. The first surface has optical microstructures. The optical microstructures are orthographically projected on a reference plane to form orthographic projection patterns. Each of the orthographic projection patterns has a first axis and a second axis substantially perpendicular to each other. The first axis passes through two end points having a maximum distance in the first direction. The second axis passes through two end points having a maximum distance in the second direction. Each of the orthographic projection patterns is symmetry to at least one of the first axis and the second axis.

Abstract: A projection screen including a substrate, Fresnel structures and a protective layer is provided. The Fresnel structures are located on a surface of the substrate facing an image-source side and arranged along a first direction. Each Fresnel structure extends along a second direction. The protective layer has a first surface facing the image-source side. The first surface has optical microstructures. The optical microstructures are orthographically projected on a reference plane to form orthographic projection patterns. Each of the orthographic projection patterns has a first axis and a second axis substantially perpendicular to each other. The first axis passes through two end points having a maximum distance in the first direction. The second axis passes through two end points having a maximum distance in the second direction. Each of the orthographic projection patterns is symmetry to at least one of the first axis and the second axis.

Abstract: A projection screen, adapted to receive an image beam, includes a transparent substrate, optical pillar structures, a light-scattering layer, Fresnel structures and a light-absorption layer. The transparent substrate has first surface and second surface opposing to each other. The optical pillar structures are located at the first surface, and between the light-scattering layer and the transparent substrate. Each optical pillar structure is arranged along the first direction. The Fresnel structures are located at the second surface, and disposed between the transparent substrate and the light-absorption layer. Each Fresnel structure has a reflective surface and a transmissive surface connected to the reflective surface. The image beam sequentially passes through the light-scattering layer, the optical pillar structures, the transparent substrate and travels to the reflective surfaces, and the image beam is reflected by the reflective surfaces and outputs from the projection screen.

Abstract: A semiconductor device includes a substrate and a semiconductor unit. The substrate includes a base and at least one pattern unit. The pattern unit includes a plurality of surrounding members disposed on the base and a central member surrounded by the surrounding members. A geometrical center is collectively defined by the surrounding members, an interval between the central member and the geometrical center is larger than zero. The semiconductor unit is disposed on the substrate and is operating with a current.

Abstract: A method for analyzing and classifying electronic documents. The method comprises steps of fetching an electronic document from an electronic document folder, wherein the electronic document comprises a plurality of key words. Then, the key words are retrieved. Further, according to an appearance frequency of each key word, a correlation between each two key words is calculated. Further, according to the correlations between the key words, the key words are classified into at least one technology group. Finally, the documents in the document folder are classified into at least one document group.