Patents by Inventor Fu-Hsuan YANG

Fu-Hsuan YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS transducing apparatus and method of fabricating the same
    Patent number: 11401159
    Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: August 2, 2022
    Assignee: FORMOSA MATERIAL INDUSTRIAL CORP.
    Inventors: Chun-Lung Huang, Ying-Hsiang Chen, Fu-Hsuan Yang
  • MEMS TRANSDUCING APPARATUS AND METHOD OF FABRICATING THE SAME
    Publication number: 20210300748
    Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Inventors: Chun-Lung HUANG, Ying-Hsiang CHEN, Fu-Hsuan YANG