Patents by Inventor Fu-Kang Tien
Fu-Kang Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10867831Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.Type: GrantFiled: August 14, 2020Date of Patent: December 15, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou
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Publication number: 20200373185Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.Type: ApplicationFiled: August 14, 2020Publication date: November 26, 2020Inventors: Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou
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Patent number: 10748803Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.Type: GrantFiled: April 22, 2019Date of Patent: August 18, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou
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Publication number: 20190244851Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.Type: ApplicationFiled: April 22, 2019Publication date: August 8, 2019Inventors: Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou
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Patent number: 10269611Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.Type: GrantFiled: March 19, 2018Date of Patent: April 23, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou
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Patent number: 7981212Abstract: A flash lamp annealing device comprises a heater plate, a loader, a lamp set and a control circuit. The heater plate heats a wafer to a predetermined temperature. The wafer is loaded on the loader disposed on the heater plate. The lamp set has one or a plurality of lamps to provide the wafer with a power. The control circuit is coupled to the lamp set to control the flash time of the lamp set.Type: GrantFiled: March 29, 2006Date of Patent: July 19, 2011Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fu-Kang Tien, Jui-Pin Hung
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Patent number: 7905109Abstract: A rapid cooling system for a rapid thermal processing chamber includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.Type: GrantFiled: September 14, 2005Date of Patent: March 15, 2011Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien Ling Hwang, Yu-Liang Lin, Fu-Kang Tien, Jyh-Chemg Sheu
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Patent number: 7758338Abstract: An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.Type: GrantFiled: May 29, 2007Date of Patent: July 20, 2010Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Fu-Kang Tien, Jui-Pin Hung
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Publication number: 20080298933Abstract: An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.Type: ApplicationFiled: May 29, 2007Publication date: December 4, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Fu-Kang Tien, Jui-Pin Hung
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Publication number: 20070235662Abstract: A flash lamp annealing device comprises a heater plate, a loader, a lamp set and a control circuit. The heater plate heats a wafer to a predetermined temperature. The wafer is loaded on the loader disposed on the heater plate. The lamp set has one or a plurality of lamps to provide the wafer with a power. The control circuit is coupled to the lamp set to control the flash time of the lamp set.Type: ApplicationFiled: March 29, 2006Publication date: October 11, 2007Inventors: Fu-Kang Tien, Jui-Pin Hung
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Publication number: 20070056512Abstract: A rapid cooling system for a rapid thermal processing chamber is disclosed. In one embodiment, the rapid cooling system includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.Type: ApplicationFiled: September 14, 2005Publication date: March 15, 2007Inventors: Chien Hwang, Yu-Liang Lin, Fu-Kang Tien, Jyh-Chemg Sheu
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Patent number: 5883393Abstract: A plurality of removable shields are disclosed for use with ion source in ion implanters. Specifically, the shields fit over the extraction electrode assembly, the sides of the interior walls and the cold-plate inside an ion source chamber. The shields are easily mountable and dismountable by the maintenance personnel. It is shown that shields can very effectively protect the insides of ion source from contamination by toxic materials emanating from the ionization source. A method is also disclosed for cleaning the shields outside the ion source by means of bead blasting followed by washing by deionized water and rinse with isopropyl alcohol. It is shown that the turn-around-time for preventive maintenance of an ion source in an ion implanter can be shortened by a factor of four.Type: GrantFiled: April 6, 1998Date of Patent: March 16, 1999Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Fu-Kang Tien, H. J. Chang
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Patent number: 5777209Abstract: The present invention discloses a leakage detection apparatus for testing the vacuum tightness of a semiconductor processing equipment which is equipped with a universal adapter head for testing various components of the equipment and a method for conducting such tests. Valuable down time can be saved on the semiconductor fabrication equipment by pre-screening all components on the basis of vacuum tightness testing done by a leak detection chamber supplied with such universal adapter head before they are assembled into the fabrication equipment after a maintenance or cleaning procedure is conducted on the components.Type: GrantFiled: December 13, 1996Date of Patent: July 7, 1998Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Fu-Kang Tien
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Patent number: 5763895Abstract: A plurality of removable shields are disclosed for use with ion source in ion implanters. Specifically, the shields fit over the extraction electrode assembly, the sides of the interior walls and the cold-plate inside an ion source chamber. The shields are easily mountable and dismountable by the maintenance personnel. It is shown that shields can very effectively protect the insides of ion source from contamination by toxic materials emanating from the ionization source. A method is also disclosed for cleaning the shields outside the ion source by means of bead blasting followed by washing by deionized water and rinse with isopropyl alcohol. It is shown that the turn-around-time for preventive maintenance of an ion source in an ion implanter can be shortened by a factor of four.Type: GrantFiled: January 13, 1997Date of Patent: June 9, 1998Assignee: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Fu-Kang Tien, H. J. Chang