Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: A device for assembling a camera module includes a base and a buffer layer. The camera module includes a flexible printed circuit board (FPCB), a lens module positioned on the FPCB, and a stiffener adhering to the FPCB, opposite to the lens module. The lens module includes a first stepped surface facing away from the FPCB. The base includes a supporting surface for supporting the FPCB and defines a holding groove in the supporting surface for holding the lens module. The holding groove forms a second stepped surface for supporting the first stepped surface. The buffer layer is positioned on the second stepped surface and is elastically compressed when the camera module is subjected to a hot pressing process, which secures the stiffener adhering to the FPCB, to provide relief against, and extend the duration of, various pressures applied to the camera module.