Patents by Inventor Fu-Weng Tea

Fu-Weng Tea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6647310
    Abstract: An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrated circuit, is covered by a block of thermally conductive material of predetermined thickness T, where T is a function of a desired temperature profile and, optionally, the current drawn by the microprocessor undergoing testing.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: November 11, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: John Yi, Fu-Weng Tea