Abstract: A pick and place tool (10) includes a housing (11), a button (12), a linking pole (13) and a sealing stuff (14). The sealing stuff includes a fastening portion (141 held in the housing, and a sealing portion (142) extending from the fastening portion, wherein the sealing portion is deformable. The sealing portion forms a gas cavity (144). A head part of the linking pole is fixed with the button. A tail part (132) of the button has a same shape as the sealing portion of the sealing stuff. The button and the linking pole can remove relative to the housing together. In a free state, the tail part of the linking pole abuts against the sealing portion and separates the fastening portion and the sealing portion of the stuff. While operating an IC package with the pick and place tool, a user should place the sealing portion of the stuff on an upper surface (21) of an IC package (20), and should hustle the gas out of the gas cavity to reduce the air pressure. Accordingly, the IC package is adsorbed by the tool.