Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A vehicle deceleration warning apparatus is activated immediately when a driver of the vehicle intends to decelerate. The vehicle deceleration warning apparatus includes an ignition monitoring module, a first microprocessor module, a wireless transmitting module, a wireless receiving module, a second microprocessor module, and a display driving module. The ignition monitoring module receives an ignition signal and delivers it to the first microprocessor module. The first microprocessor module performs a calculation by adopting the ignition signal to generate a control signal. Then, the control signal is transmitted to the second microprocessor module wireless transmission. Finally, the second microprocessor module controls the display driving module to generate a display driving signal to a display device, such as a brake light and a warning lamp, so as to generate a warning light representing deceleration of the vehicle.

Abstract: A vehicle deceleration warning apparatus is activated immediately when a driver of the vehicle intends to decelerate. The vehicle deceleration warning apparatus includes an ignition monitoring module, a first microprocessor module, a wireless transmitting module, a wireless receiving module, a second microprocessor module, and a display driving module. The ignition monitoring module receives an ignition signal and delivers it to the first microprocessor module. The first microprocessor module performs a calculation by adopting the ignition signal to generate a control signal. Then, the control signal is transmitted to the second microprocessor module wireless transmission. Finally, the second microprocessor module controls the display driving module to generate a display driving signal to a display device, such as a brake light and a warning lamp, so as to generate a warning light representing deceleration of the vehicle.