Abstract: A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Abstract: A read method for multiple-value information in a semiconductor memory such as a nonvolatile semiconductor memory is introduced. The method includes obtaining a first data from a selected multiple-value memory cell by applying a first voltage to a control gate of the selected multiple-value memory cell. A second data from the selected multiple-value memory cell is obtained by applying a second voltage to the control gate of the selected multiple-value memory cell. A first bit of the plurality of bits stored in the selected multiple-value memory cell is then obtained by performing a predetermined calculation on the first data and the second data. A second bit of the plurality of bits is obtained from the selected multiple-value memory cell by applying a third voltage to the control gate of the selected multiple-value memory cell.

Abstract: A method and related system for programming connections between a NAND flash memory controller and a plurality of NAND flash memory modules includes the NAND flash memory controller generating a switch signal and a swap signal according to a condition of one of the plurality of NAND flash memory modules, a remap module selectively coupling the plurality of NAND flash memory modules to the NAND flash memory controller according to the switch signal, and a swap module selectively coupling the plurality of NAND flash memory modules to the NAND flash memory controller according to the swap signal.

Abstract: A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Abstract: A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Abstract: A read method for multiple-value information in a semiconductor memory such as a nonvolatile semiconductor memory is introduced. The method includes obtaining a first data from a selected multiple-value memory cell by applying a first voltage to a control gate of the selected multiple-value memory cell. A second data from the selected multiple-value memory cell is obtained by applying a second voltage to the control gate of the selected multiple-value memory cell. A first bit of the plurality of bits stored in the selected multiple-value memory cell is then obtained by performing a predetermined calculation on the first data and the second data. A second bit of the plurality of bits is obtained from the selected multiple-value memory cell by applying a third voltage to the control gate of the selected multiple-value memory cell.

Abstract: A hierarchical mechanism for preventing concentrated wear on single physical block or a specific set of physical blocks in the physical memory is proposed. The logical blocks mapping to the physical blocks in the physical memory are classified into two different levels for implicitly representing the modification times of the physical blocks. A modify count and a maximum modify count are further included for counting the modification times in a single process of the hierarchical mechanism and for limiting the modification times in single process, leading to the probabilities of all the physical blocks being modified in the physical memory being balanced. The breakdown of the physical memory caused by the breakdown of a specific set of physical blocks or single physical block is thus prevented.

Abstract: A flash memory system is disclosed. The flash memory system includes a host and a flash memory card. The data transmission between the host and the flash memory card can be achieved with a clock signal for synchronization. The data is transmitted between the host and the flash memory card both at the falling edges and the rising edges of the clock signal.

Abstract: A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Abstract: Without directly changing the fixed code masked in a read-only memory, the updatable code is stored in a programmable memory such as the flash memory in advance. When a corresponding procedure is to be executed, the updatable codes are first loaded into the random access memory. When the procedure is executed, the execution jumps to the random access memory for executing the updatable codes. Therefore, if a programmer would like to update the procedure, only updating the updatable code stored in the flash memory in advance is required.

Abstract: A vertical split gate memory cell of silicon-oxide-nitride-oxide-silicon (SONOS) type formed in a trench of a semiconductor substrate includes a first doping region, a second doping region, a conductive line, a conductive plug, a first insulating layer and a second insulating layer, wherein the conductive line and conductive plug serve as a select gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed in the bottom of the trench and in operation relation to the first doping region. The first insulating layer is between the conductive line and the first doping region for insulation. The conductive plug is formed above the conductive line, and insulated from the conductive line by the second insulating layer.

Abstract: An operation method for a non-volatile memory structure formed between two doping regions serving as bit lines in a semiconductor substrate, the non-volatile memory structure comprising a first conductive line serving as a select gate and being formed above the semiconductor substrate, two conductive blocks serving as floating gates and being formed at the two sides of the first conductive line and insulated from the first conductive line with two first dielectric spacers therebetween, a first dielectric layer formed on the two second conductive blocks, a second conductive line serving as a word line and being formed on the first dielectric layer and substantially perpendicular to the two doping regions.

Abstract: A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.

Abstract: An operation method for a memory structure formed between two doping regions serving as bit lines in a semiconductor substrate, the memory structure comprising a first conductive line serving as a select gate and being formed above the semiconductor substrate, two conductive blocks serving as floating gates and being formed at the two sides of the first conductive line and insulated from the first conductive line with two first dielectric spacers therebetween, a first dielectric layer formed on the two second conductive blocks, a selected second conductive line serving as a word line and being formed on the first dielectric layer and substantially perpendicular to the two doping regions, and a plurality of unselected second conductive lines parallel to the selected second conductive line; wherein reading the programmed status of one of the conductive blocks comprising the step of putting a bias voltage on the doping region next to the other conductive block so that the depletion region is created across the o

Abstract: A vertical split gate memory formed in a trench of a semiconductor substrate comprises a first doping region, a second doping region, a conductive line, a conductive spacer and a conductive plug, wherein the conductive line, conductive spacer and conductive plug serve as a select gate, a floating gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed at the bottom of the trench and in operation relation to the first doping region. The conductive spacer is formed beside the sidewall of the trench and above the conductive line. The conductive plug is insulated from the conductive spacer and the conductive line and in operation relation to the conductive spacer.

Abstract: A memory structure in a semiconductor substrate essentially comprises a first conductive line, two conductive blocks, two first dielectric spacers, a first dielectric layer, and a second conductive line. The first conductive line, e.g., a polysilicon line, is formed above the semiconductor substrate, and the two conductive blocks composed of polysilicon, for example, are formed at the two sides of the first conductive line and insulated from the first conductive line with the two first dielectric spacers. The first dielectric layer, such as an oxide/nitride/oxide (ONO) layer, is formed on the two second conductive blocks and above the first conductive line, and the second conductive line is formed on the first dielectric layer and is substantially perpendicular to the two doping regions. Accordingly, the stack of the conductive block, the first dielectric layer, and the second conductive line form a floating gate structure which can store charges.

Abstract: A memory structure comprises two bit lines, a first gate dielectric, a second gate dielectric, at least one first gate, a second gate and a third gate, a first dielectric spacer and a second dielectric spacer, where the two bit lines are formed in the semiconductor substrate, the first gate dielectric, and the second gate dielectric are between the two bit lines, in which at least one of the first and second gate dielectrics includes a silicon nitride. For instance, a first gate dielectric is made of ONO, whereas the second gate dielectric is composed of silicon oxide. The first gate is formed above the first gate dielectric, the second gate is formed above the second gate dielectric and is substantially perpendicular to the first gate, and the third gate is substantially parallel to the second gate. The second gate is insulated from the first gate by the first dielectric spacer, whereas the second gate is insulated from the third gate by the second dielectric spacer.

Abstract: An ONO formation method comprises the following procedures. First, a bottom oxide layer is formed on a silicon substrate, and then a silicon-rich nitride layer is deposited on the bottom oxide layer. Then, an oxidation process is performed to react with silicon atoms in the silicon-rich nitride layer, so as to form a top oxide layer. Alternatively, the silicon-rich layer can be replaced with a combination of a nitride layer and a polysilicon layer. The oxidation process can consume the polysilicon layer into the top oxide layer, and proper oxygen is introduced into the nitride layer.

Abstract: A memory structure includes a floating gate and a nitride gate dielectric on a semiconductor substrate, wherein the floating gate and nitride gate dielectric function as two memory cells. In addition to the floating gate and nitride gate dielectric, the memory structure further comprises two bitlines and a select gate. The two bitlines are formed in the semiconductor substrate, the floating gate and the select gate are formed above the semiconductor substrate and transversely disposed between the two bitlines, and the nitride gate dielectric is formed between the select gate and the semiconductor substrate.

Abstract: A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.