Abstract: A resin composition according to the present invention is characterized by containing, with respect to 100 parts by mass of the thermoplastic, carbon fibers in a range of 2 parts by mass or more and 70 parts by mass or less and a silane coupling agent in a range of 0.3 parts by mass or more and 7 parts by mass or less.

Abstract: A polyimide resin composition includes a polyimide resin and a filler dispersed in the polyimide resin, in which the polyimide resin has a dicarboxylic acid group or an acid anhydride group of the dicarboxylic acid group at both ends, and the filler includes at least one inorganic compound selected from the group consisting of aluminum oxide, aluminum hydroxide, magnesium oxide, and magnesium hydroxide on a surface thereof.

Abstract: A variable magnification optical system (ZL) comprises a first lens group (G1) having negative refractive power, and a rear group (GR) having at least one lens group, the distance between lens groups adjacent to each other changes when the magnification is changed, and the following conditional expression is satisfied. 0.90<TLt/ft<1.50 where TLt is the total length of the variable magnification optical system (ZL) in a telephoto end state, and ft is the focal distance of the variable magnification optical system (ZL) in the telephoto end state.

Abstract: A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50° C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m·K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.

Abstract: A member for a plasma processing apparatus includes a base material and a heat transfer layer provided on one surface of the base material, and the heat transfer layer contains at least one of a fluorine-based resin and a fluorine-based elastomer.

Abstract: A metal base substrate of the present invention includes a metal substrate, an insulating layer, and a circuit layer, which are laminated in this order, in which the insulating layer contains an insulating resin and an inorganic filler, and an elastic modulus (unit: GPa) at 100° C. of the insulating layer, an elastic modulus (unit: GPa) at 100° C. of the circuit layer, a thickness (unit: ?m) of the insulating layer, a thickness (unit: ?m) of the circuit layer, and a thickness (unit: ?m) of the metal substrate are set so as to satisfy predetermined formulae.

Abstract: A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100° C. or higher and 150° C. or lower, the insulating layer contains a resin, and a relationship between a thickness t (?m) of the insulating layer and an elastic modulus E (GPa) of the insulating layer at 100° C. satisfies a following formula (1).

Abstract: A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: µm) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

Abstract: The joined structure of the present invention is a joined structure in which a substrate having a circuit pattern and a member to be joined including an electrode terminal are joined together via a conductive joining material. When a contact area between the circuit pattern and the conductive joining material is defined as X, a contact area between the electrode terminal and the conductive joining material is defined as Y, and a thermal conductivity of the conductive joining material is defined as ?, the joined structure satisfies the following Formula (1), SQRT(X)/SQRT(Y)?2.9209×??0.141??(1).

Abstract: A metal base substrate comprising: a metal base; an insulating layer; and a circuit layer, the metal base, the insulating layer and the circuit layer being laminated in an order, wherein the insulating layer includes a resin, a film thickness of the circuit layer is in a range of 10 ?m or more and 1000 ?m or less, and an average grain size, which is expressed by a unit of and a purity, which is expressed by a unit of mass %, satisfy a formula (1) below, average grain size/(100?Purity)>5 (1).

Abstract: An insulating film of the present invention includes a resin formed of polyimide, polyamide-imide, or a mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more, in which the ceramic particles form aggregated particles and a content of the ceramic particles is in a range of 5 vol % or more and 60 vol % or less.

Abstract: A metal base substrate including: a metal base; an insulation layer; and a circuit layer, the metal base, the insulation layer and the circuit layer being laminated in an order, wherein the insulation layer includes a resin, a film thickness of the circuit layer is in a range of 10 ?m or more and 1000 ?m or less, and a yield stress of the circuit layer is in a range of 10 MPa or more and 150 MPa or less.

Abstract: An insulating film includes: a resin consisting of a polyimide, a polyamide-imide, or a mixture thereof; and ?-alumina single crystal particles having an average particle diameter in a range of 0.3 ?m or more and 1.5 ?m or less, in which an amount of the ?-alumina single crystal particles is in a range of 8% by volume or more and 80% by volume or less. An insulated conductor includes: a conductor; and an insulating film provided on a surface of the conductor, in which the insulating film consists of the insulating film. A metal base substrate includes a metal substrate, an insulating film, and a metal foil which are laminated in this order, in which the insulating film consists of the insulating film.

Abstract: A vehicle height adjustment device includes a rear suspension, an electromagnetic valve control unit, and a weight estimation unit. The rear suspension includes a support member. The electromagnetic valve control unit determines a target movement based on an interrelation between the target movement and a weight applied to a vehicle, under which the target movement is set to an upper limit when the weight is larger than a predetermined weight, so that an actual movement of the support member reaches the target movement. The electromagnetic valve control unit determines the target movement based on a temporary weight. The weight estimation unit increases the temporary weight, even when the actual movement reached the target movement. The electromagnetic valve control unit decreases the target length, even when the temporary weight increased. The weight estimation unit estimates as the weight the temporary weight when the actual length has finally reached the target length.

Abstract: This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

Abstract: A metal base substrate includes a metal substrate (10), an insulating layer (20), and a metal foil (40) which are laminated in this order, wherein the metal base substrate further includes an adhesive layer (30) between the insulating layer (20) and the metal foil (40), and the adhesive layer (30) satisfies Expressions (1) to (3), in which E represents a Young's modulus at 25° C. having a unit of GPa, T represents a thickness having a unit of ?m, and ? represents a thermal conductivity in a thickness direction having a unit of W/mK, E?1??(1) 5?T/E??(2) T/?<20.

Abstract: This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

Abstract: A vehicle height adjustment device includes a rear suspension, an electromagnetic valve control unit, and a weight estimation unit. The rear suspension includes a support member. The electromagnetic valve control unit determines a target movement based on an interrelation between the target movement and a weight applied to a vehicle, under which the target movement is set to an upper limit when the weight is larger than a predetermined weight, so that an actual movement of the support member reaches the target movement. The electromagnetic valve control unit determines the target movement based on a temporary weight. The weight estimation unit increases the temporary weight, even when the actual movement reached the target movement. The electromagnetic valve control unit decreases the target length, even when the temporary weight increased. The weight estimation unit estimates as the weight the temporary weight when the actual length has finally reached the target length.

Abstract: A vehicle height adjustment device includes front forks, a rear suspension, a weight estimation unit, and a front wheel-side target movement amount determination unit. The front fork includes a front wheel-side suspension spring and a front wheel-side support member, which supports one end of the front wheel-side suspension spring, and moves toward another end of the front wheel-side spring to change the front wheel-side suspension spring length. The rear suspension includes a rear wheel-side suspension spring and a rear wheel-side support member, which supports one end of the rear wheel-side suspension spring, and moves toward another one end of the rear wheel-side spring to change the rear wheel-side suspension spring length. The weight estimation unit estimates a weight applied to a vehicle. The front wheel-side target movement amount determination unit decreases, a movement amount of the front wheel-side support member as the estimated weight increases.

Abstract: A vehicle height adjustment device includes an actuator, a detector, and a controller. The actuator is driven when supplied with a current and is configured to change a relative position of a body of a vehicle relative to an axle of a wheel of the vehicle. The detector is configured to detect the relative position. The controller is configured to control the current supplied to the actuator to make the relative position a target value so as to adjust a vehicle height of the body. When a detection value of the detector is smaller than the target value of the relative position, the controller is configured to alternately supply an increase current and a maintenance current to the actuator. The increase current increases the relative position to increase the vehicle height. The maintenance current maintains the relative position to maintain the vehicle height.