Abstract: A bonded assembly includes a memory die that is bonded to a logic die. The memory die includes a three-dimensional memory array located on a memory-side substrate, memory-side dielectric material layers located on the three-dimensional memory array and embedding memory-side metal interconnect structures and memory-side bonding pads, a backside peripheral circuit located on a backside surface of the memory-side substrate, and backside dielectric material layers located on a backside of the memory-side substrate and embedding backside metal interconnect structures. The logic die includes a logic-side peripheral circuit located on a logic-side substrate, and logic-side dielectric material layers located between the logic-side substrate and the memory die and embedding logic-side metal interconnect structures and logic-side bonding pads that are bonded to a respective one of the memory-side bonding pads.

Abstract: A detector includes a unit cell array in which a plurality of unit cells are arranged. The plurality of unit cells include a first unit cell including a first conversion element and a first amplification transistor including a control electrode connected to the first conversion element, the first unit cell being configured to output a signal obtained by amplifying the signal charge by the first amplification transistor, and a second unit cell including a second amplification transistor including a control electrode connected to a constant voltage source, the second amplification transistor being configured to output a signal corresponding to a voltage of the constant voltage source by the second amplification transistor. The first unit cell and the second unit cell are disposed in an irradiated region in the unit cell array, the irradiated region being configured to be irradiated with the energy beam.

Abstract: A detector includes: a first member that detects a radioactive ray; a second member located around the first member; a third member having a first opening overlapping at least a part of a first region on which the first member is projected in a planar view including the first member and the second member; a fourth member having a second opening overlapping at least a part of the first region in the planar view and having higher thermal conductivity than the third member; and a penetration part provided in a third region overlapping the fourth member outside a second region on which the second member is projected in the planar view, connected to the fourth member, connected to the second member via a thermal conductive member, and having higher thermal conductivity than the third member.

Abstract: An imaging apparatus includes: a detector configured to detect a surface position of an object by receiving a second electromagnetic wave of which wavelength is shorter than a first electromagnetic wave; a focusing device configured to collect the first electromagnetic wave reflected on the object; at least one memory and at least one processor which function as a control unit configured to control the focusing device such that a position based on the surface position is focused on; and an image sensor configured to image the object using the first electromagnetic wave collected by the focusing device.

Abstract: A deformable mirror includes a mirror substrate having a continuous reflective surface and a plurality of actuators connected to the mirror substrate at a plurality of coupling portions. In the deformable mirror, the mirror substrate has first regions and a second region thicker than the first regions and the first regions are formed around the coupling portions.

Abstract: The present invention provides a lithography system including an obtaining unit which obtains a transfer function describing a relationship between first vibration generated in one lithography apparatus of two lithography apparatuses among at least three lithography apparatuses, and second vibration generated in the other lithography apparatus upon transmission of the first vibration to the other lithography apparatus, and a calculator which calculates, based on the transfer function, an amount of vibration of a first lithography apparatus among the at least three lithography apparatuses due to vibration of lithography apparatuses, other than the first lithography apparatus, and a controller which controls the lithography apparatuses other than the first lithography apparatus, so that the amount of vibration calculated falls below a tolerance.

Abstract: A deformable mirror includes a mirror substrate having a continuous reflective surface and a plurality of actuators connected to the mirror substrate at a plurality of coupling portions. In the deformable mirror, the mirror substrate has first regions and a second region thicker than the first regions and the first regions are formed around the coupling portions.

Abstract: The present invention provides a lithography system including an obtaining unit which obtains a transfer function describing a relationship between first vibration generated in one lithography apparatus of two lithography apparatuses among at least three lithography apparatuses, and second vibration generated in the other lithography apparatus upon transmission of the first vibration to the other lithography apparatus, and a calculator which calculates, based on the transfer function, an amount of vibration of a first lithography apparatus among the at least three lithography apparatuses due to vibration of lithography apparatuses, other than the first lithography apparatus, and a controller which controls the lithography apparatuses other than the first lithography apparatus, so that the amount of vibration calculated falls below a tolerance.