Abstract: A motor includes a rotor and a stator. The stator is formed by laminating a plurality of magnetic thin strips each having a plurality of teeth parts. The magnetic thin strip includes an elliptical-shaped inner diameter part formed along tip end portions of the plural teeth parts. At least one magnetic thin strip in the laminated magnetic thin strips is shifted by a given angle with respect to other magnetic thin strips in a horizontal direction, and positions of all teeth parts of the laminated magnetic thin strips correspond to one another to reduce cogging torque.

Abstract: The cooling apparatus includes: a thermal insulation box; a door; and a magnetic gasket, the magnetic gasket having: a magnet; a magnet retaining part; and a heat insulation sheet being provided between the magnet and the magnet retaining part and being provided, in a closed state in which the opening is closed by the door, on a side portion on a side of the door on a peripheral surface of the magnet and on a side portion facing an inner side in a width direction in the closed state on the peripheral surface of the magnet.

Abstract: A motor includes a rotor and a stator. The stator is formed by laminating a plurality of magnetic thin strips each having a plurality of teeth parts. The magnetic thin strip includes an elliptical-shaped inner diameter part formed along tip end portions of the plural teeth parts. At least one magnetic thin strip in the laminated magnetic thin strips is shifted by a given angle with respect to other magnetic thin strips in a horizontal direction, and positions of all teeth parts of the laminated magnetic thin strips correspond to one another to reduce cogging torque.

Abstract: Provided are a magnet gasket and a cooling apparatus which enhance thermal insulation performance. The cooling apparatus includes: a thermal insulation box that has an opening end surface enclosing the opening and facing frontward; a door capable of opening and closing the opening; and a magnetic gasket attached to an inside peripheral portion of the door facing the opening end surface while the opening is closed, the magnetic gasket having: a magnet; a magnet retaining part; and a heat insulation sheet being provided between the magnet and the magnet retaining part and being provided, in a closed state in which the opening is closed by the door, on a side portion on a side of the door on a peripheral surface of the magnet and on a side portion facing an inner side in a width direction in the closed state on the peripheral surface of the magnet.

Abstract: The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

Abstract: A resin-encapsulated semiconductor device includes a die pad, a semiconductor chip mounted on the die pad, and a group of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, the first lead and the third lead are separated from each other in a subsequent step. Moreover, a thin metal wire for connecting an electrode of the semiconductor chip to the bonding pad of each lead, and an encapsulation resin for encapsulating the semiconductor chip, the leads, the thin metal wire, etc., are provided. The pad of each lead is exposed on a surface of the encapsulation resin so that the pad can function as an external terminal.

Abstract: A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, a connecting portion therebetween has a smaller thickness than that of the frame body so that the first lead and the third lead can be separated from each other in a subsequent step.

Abstract: A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the half-etched portions of the first signal connection leads. Even when the thin metal wire is connected to the half-etched portion of each first signal connection lead, pressing force and heat can be effectively applied to the connection.

Abstract: The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

Abstract: A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the half-etched portions of the first signal connection leads. Even when the thin metal wire is connected to the half-etched portion of each first signal connection lead, pressing force and heat can be effectively applied to the connection.

Abstract: A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, a connecting portion therebetween has a smaller thickness than that of the frame body so that the first lead and the third lead can be separated from each other in a subsequent step.

Abstract: A resin-encapsulated semiconductor device includes a die pad, a semiconductor chip mounted on the die pad, and a group of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, the first lead and the third lead are separated from each other in a subsequent step. Moreover, a thin metal wire for connecting an electrode of the semiconductor chip to the bonding pad of each lead, and an encapsulation resin for encapsulating the semiconductor chip, the leads, the thin metal wire, etc., are provided. The pad of each lead is exposed on a surface of the encapsulation resin so that the pad can function as an external terminal.

Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).