Patents by Inventor Fumihiko Nakazawa
Fumihiko Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130045626Abstract: A power strip includes a casing including a plurality of plug insertion portions each having a first insertion port and a second insertion port into which first and second plug blades of a socket plug are to be respectively inserted, a magnetic core which is provided in each of the plurality of plug insertion portions and includes a first opening into which the first plug blade is to be inserted, a second opening into which the second plug blade is to be inserted, and a slit to communicate between the first plug blade and the second plug blade, and a magnetic sensor provided inside the slit.Type: ApplicationFiled: August 20, 2012Publication date: February 21, 2013Applicant: FUJITSU LIMITEDInventors: Hiromitsu SONEDA, Osamu TSUBOI, Fumihiko NAKAZAWA
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Publication number: 20130010447Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Inventors: Hiroaki Inoue, Takashi Katsuki, Fumihiko Nakazawa
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Patent number: 8289723Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.Type: GrantFiled: July 16, 2009Date of Patent: October 16, 2012Assignee: Fujitsu LimitedInventors: Hiroaki Inoue, Takashi Katsuki, Fumihiko Nakazawa
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Patent number: 8283735Abstract: A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.Type: GrantFiled: January 15, 2010Date of Patent: October 9, 2012Assignee: Fujitsu LimitedInventors: Hiroaki Inoue, Takashi Katsuki, Fumihiko Nakazawa
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Patent number: 8269752Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.Type: GrantFiled: December 9, 2009Date of Patent: September 18, 2012Assignee: Fujitsu LimitedInventors: Yuji Takahashi, Fumihiko Nakazawa, Satoshi Sano, Takashi Katsuki
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Patent number: 8230740Abstract: An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.Type: GrantFiled: July 14, 2009Date of Patent: July 31, 2012Assignee: Fujitsu LimitedInventors: Takashi Katsuki, Fumihiko Nakazawa, Hiroaki Inoue
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Patent number: 8040327Abstract: Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.Type: GrantFiled: August 8, 2008Date of Patent: October 18, 2011Assignee: Fujitsu LimitedInventors: Satoshi Sano, Takashi Katsuki, Yuji Takahashi, Fumihiko Nakazawa
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Publication number: 20110187348Abstract: The following disclosure provides a power strip including: a busbar electrically connected to a power source; multiple electrical outlets allowing multiple power plugs to be inserted thereinto, respectively; distribution bars which are branched out from the busbar and respectively supply the electrical outlets with electric currents of the power source; and a plurality of electric current measurement units each configured to measure the electric current flowing through a corresponding one of the distribution bars.Type: ApplicationFiled: January 19, 2011Publication date: August 4, 2011Applicants: FUJITSU LIMITED, FUJITSU COMPONENT LIMITEDInventors: Hiromitsu Soneda, Osamu Tsuboi, Fumihiko Nakazawa, Naoyuki Nagao
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Patent number: 7932900Abstract: Surface acoustic waves are propagated in a lower-left oblique direction and a lower-right oblique direction from an excitation element located on the upper side of a non-piezoelectric substrate and then received by receiving elements located on the left side and the right side, while surface acoustic waves are propagated in an upper-left oblique direction and an upper-right oblique direction from an excitation element located on the lower side of the non-piezoelectric substrate and then received by the receiving elements located on the left side and the right side. Based on the received results at the two receiving elements, a position of an object in contact with the non-piezoelectric substrate is detected.Type: GrantFiled: November 28, 2006Date of Patent: April 26, 2011Assignee: Fujitsu LimitedInventors: Satoshi Sano, Takashi Katsuki, Yuji Takahashi, Fumihiko Nakazawa
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Patent number: 7914355Abstract: First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. Next, piezoelectric elements functioning a SAW touch sensor are formed on a second major surface of the transparent substrate. Next, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.Type: GrantFiled: February 8, 2006Date of Patent: March 29, 2011Assignees: Tohoku Pioneer Corporation, Fujitsu Limited, Fujitsu Component LimitedInventors: Fumihiko Nakazawa, Takashi Katsuki, Yuji Takahashi, Satoshi Sato, Satoshi Sasaki, Tamotsu Watanabe, Kunizo Ogoshi, Michiko Endo
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Patent number: 7859522Abstract: A touch panel device includes an excitation transducer for exciting a surface acoustic wave upon application of a burst wave and a reception transducer for receiving the surface acoustic wave and converting the same into a reception signal that are arranged at a peripheral portion of a detection area so that a position of an object touching the detection area is detected in accordance with a change in the reception signal. A control method for eliminating noises in the touch panel device includes the steps of detecting a differential between a reception signal due to a burst wave and another reception signal due to another burst wave, deciding that there is a noise if the detected differential exceeds a preset threshold value, and performing a control operation so that the detection of an object based on the reception signal is not performed in accordance with the decision.Type: GrantFiled: August 16, 2005Date of Patent: December 28, 2010Assignee: Fujitsu LimitedInventors: Yuji Takahashi, Fumihiko Nakazawa, Satoshi Sano, Takashi Katsuki
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Publication number: 20100218977Abstract: A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.Type: ApplicationFiled: January 15, 2010Publication date: September 2, 2010Applicant: FUJITSU LIMITEDInventors: Hiroaki Inoue, Takashi Katsuki, Fumihiko Nakazawa
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Patent number: 7705836Abstract: A plurality of excitation elements are disposed on two facing sides of a quadrilateral detection range in a non-piezoelectric substrate, and a plurality of receiving elements are disposed on the other two sides of the detection range so as to face the excitation elements respectively. Surface acoustic waves are transmitted from the respective plurality of excitation elements in two diagonal directions of the detection range respectively, and the surface acoustic waves from the two diagonal directions are received by the respective receiving elements, so that a position of an object in contact with the substrate is detected based on received results in the receiving elements.Type: GrantFiled: April 11, 2006Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Fumihiko Nakazawa, Satoshi Sano, Yoshio Satoh, Takashi Matsuda
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Publication number: 20100085332Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.Type: ApplicationFiled: December 9, 2009Publication date: April 8, 2010Applicant: FUJITSU LIMITEDInventors: Yuji TAKAHASHI, Fumihiko NAKAZAWA, Satoshi SANO, Takashi KATSUKI
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Publication number: 20100067208Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.Type: ApplicationFiled: July 16, 2009Publication date: March 18, 2010Applicant: FUJITSU LIMITEDInventors: Hiroaki INOUE, Takashi KATSUKI, Fumihiko NAKAZAWA
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Patent number: 7667694Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.Type: GrantFiled: October 30, 2003Date of Patent: February 23, 2010Assignee: Fujitsu LimitedInventors: Yuji Takahashi, Fumihiko Nakazawa, Satoshi Sano, Takashi Katsuki
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Publication number: 20100024547Abstract: An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.Type: ApplicationFiled: July 14, 2009Publication date: February 4, 2010Applicant: FUJITSU LIMITEDInventors: Takashi KATSUKI, Fumihiko Nakazawa, Hiroaki Inoue
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Patent number: 7605523Abstract: A piezoelectric device (X) includes a substrate (11) a piezoelectric film (12), a first electrode (13), and a second electrode (14). At least one of the first electrode (13) and the second electrode (14) is interposed between the substrate (11) and the piezoelectric film (12), and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.Type: GrantFiled: November 22, 2005Date of Patent: October 20, 2009Assignee: Fujitsu LimitedInventors: Takashi Katsuki, Fumihiko Nakazawa, Satoshi Sano, Yuji Takahashi
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Publication number: 20090156083Abstract: First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. After the step of forming the first electrodes, piezoelectric elements functioning a SAW touch sensor is formed on a second major surface of the transparent substrate. Furthermore, after the step of forming the piezoelectric elements, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed. Since the first electrodes are formed in the form of stripes, the piezoelectric elements can be prevented from being damaged by an etching solution used at this time. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.Type: ApplicationFiled: February 8, 2006Publication date: June 18, 2009Applicants: TOHOKU PIONEER CORPORATION, FUJITSU LIMITED, FUJITSU COMPONENT LIMITEDInventors: Fumihiko Nakazawa, Takashi Katsuki, Yuji Takahashi, Satoshi Sato, Satoshi Sasaki, Tamotsu Watanabe, Kunizo Ogoshi, Michiko Endo
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Publication number: 20090139328Abstract: A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products.Type: ApplicationFiled: February 27, 2008Publication date: June 4, 2009Applicants: FUJITSU LIMITED, FUJITSU MEDIA DEVICES LIMITEDInventors: Hiroaki Inoue, Fumihiko Nakazawa, Hiroshi Ishikawa, Takashi Katsuki, Takayuki Yamaji