Abstract: A polisher provided with a vibration detection system which can detect vibration caused by rubbing between an article to be polished and a polishing member without any noise which is generated in prior art polishers. The polisher includes a turntable assembly with a polishing surface, a rotatable carrier assembly for holding an article to be polished in such a manner that the article is kept in contact, under pressure with the polishing member while being polished. A vibration detector is provided on the rotatable carrier assembly in order to detect the vibration caused by the rubbing between the article and the polishing member of the turntable assembly. A light signal emission device is provided on the rotatable carrier assembly and is adapted to receive electrical signals transmitted from the vibration detector to generate and emit light signals in response to the vibration detected by the detector. A light signal receiving device is provided on a stationary part of the polisher.

Abstract: A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.

Abstract: An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on a rotating turntable so as to remove the first layer, oscillating the top ring in contact with the turntable, periodically measuring a torque on the rotating turntable when the top ring is positioned at a specific radial location defined by a radius from a rotational center of the turntable, and determining the endpoint based on a change in the torque generated when the first layer is removed and the second layer comes into contact with the polishing cloth.