Patents by Inventor Fumihiko Tokura

Fumihiko Tokura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus of fabricating perforated plate
    Patent number: 6320158
    Abstract: A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: November 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Yoshitaka Muraoka, Fumihiko Tokura