Abstract: A compound for use as a cross-linking agent represented by the following formula (1) wherein R1 is —SO2—, —O—, —CO—, an optionally substituted alkylene group, a group represented by the following formula (2) or a single bond; and two As are each independently an aromatic ring group containing a 5- or 6-membered aromatic ring and optionally containing a substituent, where the aromatic ring group contains a substituent in the case where the aromatic ring group is a monocyclic aromatic ring group containing a 6-membered aromatic hydrocarbon ring. Also disclosed is a composition containing the cross-linking agent.

Abstract: A composition including a fluorine-containing polymer and a silicon-containing compound, wherein the phosphorus content in the composition is 20 ppm or less. Also disclosed is a molded article obtained from the composition, and a second composition containing a fluorine-containing polymer and a silicon-containing polymer, wherein a content of an amide solvent in the composition is less than 1000 ppm.

Abstract: A composition containing a fluorine-containing polymer and a silicon oxide represented by formula: SiOx, where 0<x<2. In a preferred embodiment, the composition contains a cross-linking agent. Also disclosed is a crosslinked product which may be a sealing material obtained by crosslinking the composition.

Abstract: A composition including a fluorine-containing polymer and a silicon-containing compound, wherein the phosphorus content in the composition is 20 ppm or less. Also disclosed is a molded article obtained from the composition, and a second composition containing a fluorine-containing polymer and a silicon-containing polymer, wherein a content of an amide solvent in the composition is less than 1000 ppm.

Abstract: A composition including a composite particle and a fluorine-containing polymer, wherein the composite particle comprises a polymer and an inorganic particle dispersed in the polymer, and the polymer contains an acid group-containing monomer unit. Also disclosed is a molded article obtained from the composition.

Abstract: A composition having excellent scorch resistance and storage stability, the composition containing composite particles and a fluoropolymer, and the composite particles including a polymer and inorganic particles dispersed in the polymer.

Abstract: The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1): wherein X11 and X12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y11 is an oxygen atom or a sulfur atom; Rf11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.

Abstract: The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.

Abstract: The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1): wherein X11 and X12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y11 is an oxygen atom or a sulfur atom; Rf11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.

Abstract: The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against both fluorine plasma exposure and oxygen plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a cage silsesquioxane having a specific structure.

Abstract: The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.

Abstract: A composition having excellent scorch resistance and storage stability, the composition containing composite particles and a fluoropolymer, and the composite particles including a polymer and inorganic particles dispersed in the polymer.

Abstract: The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against both fluorine plasma exposure and oxygen plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a cage silsesquioxane having a specific structure.

Abstract: The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.

Abstract: The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.

Abstract: The present invention provides a wafer treating solution in which at least one of C.sub.n H.sub.2n+1 ph(SO.sub.3 M)Oph(SO.sub.3 M) wherein ph is a phenylene group, n is 5 to 20, and M is a hydrogen or salt; C.sub.n H.sub.2n+1 phO(CH.sub.2 CH.sub.2 O)mSO.sub.3 M wherein ph is a phenylene group, n is 5 to 20, m is 0 to 20, and M is a hydrogen or salt; and C.sub.n H.sub.2n+1 O(CH.sub.2 CH.sub.2 O)mSO.sub.3 M wherein n is 5 to 20, m is 0 to 20, and M is a hydrogen or salt, is dissolved in 0.1 to 1000 ppm into a 20 to 60 wt % of hydrogen fluoride (HF), and the remainder is water (100 wt % in total), and a method for preparing a low concentration of wafer treating solution by adding water, H.sub.2 O.sub.2, HNO.sub.3, CH.sub.3 COOH, NH.sub.4 F or the like, into the above solution. The present invention also provides a wafer treating solution in which at least one of surfactants represented by C.sub.n H.sub.2n+1 ph(SO.sub.3 M)Oph(SO.sub.

Abstract: The present invention provides a wafer treating solution in which at least one of C.sub.n H.sub.2n+1 ph(SO.sub.3 M)Oph(SO.sub.3 M) wherein ph is a phenylene group, n is 5 to 20, and M is a hydrogen or salt; C.sub.n H.sub.2n+1 phO(CH.sub.2 CH.sub.2 O)mSO.sub.3 M wherein ph is a phenylene group, n is 5 to 20, m is 0 to 20, and M is a hydrogen or salt; and C.sub.n H.sub.2n+1 O(CH.sub.2 CH.sub.2 O)mSO.sub.3 M wherein n is 5 to 20, m is 0 to 20, and M is a hydrogen or salt, is dissolved in 0.1 to 1000 ppm into a 20 to 60 wt % of hydrogen fluoride (HF), and the remainder is water (100 wt % in total), and a method for preparing a low concentration of wafer treating solution by adding water, H.sub.2 O.sub.2, HNO.sub.3, CH.sub.3 COOH, NH.sub.4 F or the like, into the above solution. The present invention also provides a wafer treating solution in which at least one of surfactants represented by C.sub.n H.sub.2n+1 ph(SO.sub.3 M)Oph(SO.sub.

Abstract: An acicular fine particulate material which is coated with a compound containing at least one element selected from among elements of Groups III and IV of the Periodic Table in Periods 5 and 6, the acicular fine particulate material being one of (i) an acicular fine particulate material containing iron carbide, (ii) an acicular fine particulate material containing iron carbide, metallic iron and carbon, and (iii) an acicular fine particulate metallic iron containing carbon, is prepared by a promoted reduction reaction while being effectively prevented from sintering and consequently affords magnetic recording media having a high recording density.

Abstract: The present invention provides an acicular fine particles obtained by reducing an iron carbide starting material and containing metal iron, iron carbide and free carbon, the acicular fine particles having a mean particle size (long axis) of 0.1 to 0.5 .mu.m and an average axial ratio of 3 to 15 and containing 15 to 80 wt. % of metal iron, 10 to 75 wt. % of iron carbide and 5 to 13 wt. % of free carbon, process thereof, magnetic coating composition and magnetic recording medium containing the same.