Patents by Inventor Fumihiro Yamashita

Fumihiro Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9065612
    Abstract: In a wireless transmission system that transmits and receives a modulated signal between a transmitter and a receiver that are coupled through a wireless transmission path, the transmitter includes a spectrum division filter bank dividing the modulated signal and generating a plurality of sub-spectrum signals each of which is arranged at a predetermined frequency position, and subjects the plurality of sub-spectrum signals arranged in spectra to a direct spectrum division transmission, and the receiver includes a spectrum combination filter bank extracting the plurality of sub-spectrum signals from the received signals arranged in spectra and subjected to the direct spectrum division transmission to combine the sub-spectrum signals into an original modulated signal.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: June 23, 2015
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Fumihiro Yamashita, Junichi Abe, Kiyoshi Kobayashi
  • Publication number: 20120002703
    Abstract: In a wireless transmission system that transmits and receives a modulated signal between a transmitter and a receiver that are coupled through a wireless transmission path, the transmitter includes a spectrum division filter bank dividing the modulated signal and generating a plurality of sub-spectrum signals each of which is arranged at a predetermined frequency position, and subjects the plurality of sub-spectrum signals arranged in spectra to a direct spectrum division transmission, and the receiver includes a spectrum combination filter bank extracting the plurality of sub-spectrum signals from the received signals arranged in spectra and subjected to the direct spectrum division transmission to combine the sub-spectrum signals into an original modulated signal.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 5, 2012
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Fumihiro Yamashita, Junichi Abe, Kiyoshi Kobayashi
  • Publication number: 20100219228
    Abstract: The present invention provides a reflow apparatus capable of precisely adjusting the heating temperature and heating time when heating a work for reflow. A work transfer conveyor for transferring a work into a furnace body is disposed, wherein a plurality of preheating zones through for preheating the work, a plurality of reflow zones for heating the work for reflow, and a plurality of cooling zones for cooling the work are successively arranged along the work transfer conveyor in the furnace body. The individual reflow zones are formed shorter than the individual preheating zones in the work transfer direction. It is preferable that the sizes of the individual reflow zones in the transfer direction are shortened to approximately 65% to 85% with respect to the individual preheating zones or the conventional individual reflow zones.
    Type: Application
    Filed: December 19, 2006
    Publication date: September 2, 2010
    Applicants: TAMURA CORPORATION, TAMURA FA SYSTEM CORPORATION
    Inventors: Fumihiro Yamashita, Shoichiro Matsuhisa, Takehiko Kawakami
  • Publication number: 20090206145
    Abstract: A reflow system in which a reflow furnace is sequentially divided into a plurality of zones along a conveying path of a heat target which is conveyed and by controlling temperatures of the plurality of zones, the heat target which is conveyed is reflowed has: a cooling and flux collecting apparatus circulating and cooling atmosphere gases in furnace bodies of a part or all of the plurality of zones and collecting a flux; and a flow rate control unit which is inserted into a circulating path of the atmosphere gas of each of the zones and can control a flow rate. When the temperature of the zone is reduced, by controlling the flow rate control unit, the flow rate is set to be higher than that upon collecting the flux.
    Type: Application
    Filed: February 12, 2009
    Publication date: August 20, 2009
    Applicants: Tamura Corporation, Tamura FA System Corporation
    Inventors: Nobuaki Tamori, Fumihiro Yamashita
  • Patent number: 6761301
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: July 13, 2004
    Assignees: Hitachi, Ltd., Tamura/FA System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Publication number: 20020100791
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Application
    Filed: March 15, 2002
    Publication date: August 1, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Patent number: 6412681
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: July 2, 2002
    Assignees: Hitachi, Ltd., Tamura Fa System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai
  • Publication number: 20010015368
    Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
    Type: Application
    Filed: December 11, 2000
    Publication date: August 23, 2001
    Inventors: Hideki Mukuno, Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro Yamashita, Shoichirou Matsuhisa, Hidekazu Imai