Abstract: With an object to provide a thermoelectric converter excellent in performance, this invention provides a thermoelectric converter provided with a first thermal converter 1, a blocked second thermal conductor 2 connected to a predetermined position of the first conductor 1, a frame 6 made of a synthetic resin and surrounding the second conductor 2, a thermally-conductive substrate 5 with the frame 6 fixed at a basal end portion 8 thereof on the substrate and also with a group of thermoelectric elements 4 supported inside the substrate, and a heat-insulating layer 31 interposed between the first thermal conductor 1 and the thermally-conductive substrate 5 such that the frame 6 is surrounded at an outer periphery thereof by the heat-insulating layer. The second thermal conductor 2 and the thermally-conductive substrate 5 are opposing each other and are maintained in close contact with each other via the group of thermoelectric elements 4.

Abstract: One of a heat-absorbing-side thermal conductor and a heat-dissipating-side thermal conductor is substantially in a form of a single piece. Plural groups of thermoelectric elements are arranged relative to the single-piece thermal conductor. Corresponding to the plural groups of thermoelectric elements, the other one of the heat-absorbing-side thermal conductor and the heat-dissipating-side thermal conductor is arranged in a form divided into a like number of pieces.

Abstract: A storage box apparatus makes use of thermoelectric modules as devices for cooling or heating storage units, respectively. Each thermoelectric module is provided with a heat-dissipating-side base and a heat-absorbing-side base. A liquid heat transfer medium is spouted against a surface of the heat-dissipating-side base substantially at a right angle.

Abstract: An air-conditioning ventilator is provided with an air inlet passage and an air outlet passage for ventilation and also with a heat exchanger making use of a thermoelectric module for effecting an exchange of heat with air flowing through one of the passages. At least one of a heat-absorbing system and a heat-dissipating system of the heat exchanger is provided with a heat-transfer-medium-circulating system so that a heat transfer medium is forced to circulate in a liquid form for performing the exchange of heat.

Abstract: A thermoelectric refrigerator is provided with a casing formed of a heat-insulating layer, thermal conductors arranged in the casing and having a heat transfer surface located facing a storage space in the casing, a Peltier device thermally connected with the thermal conductors, a device power supply for supplying electric power to the Peltier device, an interior fan for causing interior air to flow in the storage space, a fan power supply for supplying electric power to the interior fan, and a control unit for controlling a quantity of electric power to be supplied to the interior fan in accordance with a quantity of electric power to be supplied to the Peltier device.

Abstract: An electric refrigerator is provided with a casing formed of a heat-insulating layer and defining an opening; a heat-insulating door for openably closing the opening of the casing; a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite an interior space in the casing; a Peltier device thermally connected with the thermal conductor; and a device power supply for feeding electric power to the Peltier device. The electric refrigerator is also provided with a control unit for controlling the device power supply so that, after the heat-insulating door is closed subsequent to opening thereof, the device power supply supplies the Peltier device with electric power controlled in a range of from 1.3 to 2 times as much rated electric power required to maintain a preset interior temperature of the casing.

Abstract: A thermoelectric converter is composed of a number of p-type semiconductor chips and n-type semiconductor chips arranged side by side and electrically connected in series, a heat-absorbing-side heat conductor arranged on a heat-absorbing side of the p-type and n-type semiconductor chips, a heat-dissipating-side heat conductor arranged on a heat-dissipating side of the p-type and n-type semiconductor chips, and a device for feeding a current to the p-type and n-type semiconductor chips. The current feeding device feeds a current of a density in a current density range selected depending on a thickness of said p-type and n-type semiconductor chips.