Abstract: In a display manufacturing method including bonding of a light-transmissive substrate onto a display surface of a display body, the bonding includes bending the light-transmissive substrate into an arch-like shape with a bonding surface thereof having a convex shape. An adhesive sandwiched is put between a bonding surface of the display body and a top of a bonding surface of the bent light-transmissive substrate. The bend of the light-transmissive substrate is released while moving two rollers from a center of the light-transmissive substrate in a direction of the bend of the light-transmissive substrate towards both terminal edges of the light-transmissive substrate in mutually reverse directions. The two rollers press a non-bonding surface of the light-transmissive substrate against the display body.

Abstract: In a display manufacturing method including bonding of a light-transmissive substrate onto a display surface of a display body, the bonding includes bending the light-transmissive substrate into an arch-like shape with a bonding surface thereof having a convex shape. An adhesive sandwiched is put between a bonding surface of the display body and a top of a bonding surface of the bent light-transmissive substrate. The bend of the light-transmissive substrate is released while moving two rollers from a center of the light-transmissive substrate in a direction of the bend of the light-transmissive substrate towards both terminal edges of the light-transmissive substrate in mutually reverse directions. The two rollers press a non-bonding surface of the light-transmissive substrate against the display body.

Abstract: The invention provides a fingerprint input device with a small area and a compact structure, and being manufactured in a simple process, comprising an LED for emitting into a finger a light, an image pickup unit for receiving the light scattered inside the finger, a peripheral circuit unit connected to the image pickup unit 1a, a silicon chip 1 bearing image pickup elements constituting the image pickup unit and the peripheral circuit unit, and a fiber optics plate fixed on the silicon chip, having a surface on which the finger is placed and constituting light transmission portion for transmitting the light, scattered inside the finger placed on the surface to the image pickup element along a direction inclined by a predetermined angle. At least a part of the peripheral circuit unit is formed on the silicon chip opposed to a non-light-transmitting area of the fiber optics plate.

Abstract: An image pickup apparatus for X-ray photography is structurally adapted to absorb external impacts and possible resultant deformations such as deflections of the cabinet so that the interior is protected against damage and remains intact if the cabinet is deformed by the external load. The two-dimensional image pickup apparatus comprises a substrate, two-dimensional photoelectric converters formed on the substrate and an apparatus cabinet containing the substrate and the photoelectric converters in the inside, at least part of the apparatus cabinet being deformable and capable of restore the original profile or a plurality of containers such as air bags being inserted into the gap between said substrate and said apparatus cabinet to prevent the inner wall surface of said apparatus cabinet and said substrate from contacting each other.

Abstract: An image pickup apparatus for X-ray photography is structurally adapted to absorb external impacts and possible resultant deformations such as deflections of the cabinet so that the interior is protected against damage and remains intact if the cabinet is deformed by the external load. The two-dimensional image pickup apparatus comprises a substrate, two-dimensional photoelectric converters formed on the substrate and an apparatus cabinet containing the substrate and the photoelectric converters. At least part of the apparatus cabinet is deformable and capable of restoring its original profile. A plurality of containers such as air bags may also be inserted into the gap between the substrate and the apparatus cabinet to prevent the inner wall surface of the apparatus cabinet and the substrate from contacting each other.

Abstract: The present invention provides a fingerprint input device that is small in size and consumes less power. The fingerprint input device (101) includes: a light source unit (2) that emits light (2a) into an inside of a sliding finger (10); and an image pickup unit (1a) that includes a light-receiving area (3a) smaller than an area of a fingerprint image to be read and receives light (2b) scattered from the inside of the finger to a fingerprint surface (10a) in the light-receiving area. The light source unit is arranged on a sliding path of the finger in the vicinity of the image pickup unit so as to irradiate with light the finger, the fingerprint surface of which is in contact with the light-receiving area of the image pickup unit.

Abstract: The invention provides a fingerprint input device with a small area and a compact structure, and being manufactured in a simple process, comprising an LED for emitting into a finger a light, an image pickup unit for receiving the light scattered inside the finger, a peripheral circuit unit connected to the image pickup unit 1a, a silicon chip 1 bearing image pickup elements constituting the image pickup unit and the peripheral circuit unit, and a fiber optics plate fixed on the silicon chip, having a surface on which the finger is placed and constituting light transmission means for transmitting the light, scattered inside the finger placed on the surface to the image pickup element along a direction inclined by a predetermined angle. At least a part of the peripheral circuit unit is formed on the silicon chip opposed to a non-light-transmitting area of the fiber optics plate.

Abstract: An image pickup apparatus for X-ray photography is structurally adapted to absorb external impacts and possible resultant deformations such as deflections of the cabinet so that the interior is protected against damage and remains intact if the cabinet is deformed by the external load. The two-dimensional image pickup apparatus comprises a substrate, two-dimensional photoelectric converters formed on the substrate and an apparatus cabinet containing the substrate and the photoelectric converters in the inside, at least part of the apparatus cabinet being deformable and capable of restore the original profile or a plurality of containers such as air bags being inserted into the gap between said substrate and said apparatus cabinet to prevent the inner wall surface of said apparatus cabinet and said substrate from contacting each other.

Abstract: A fingerprint entering apparatus which has small number of parts and can be produced by simple manufacturing process and further is cheap is provided. When a near infrared ray and/or infrared ray is radiated from a LED toward a finger place closely on a transparent electrode provided on a rear face of a substrate, the radiated ray is scattered in the inside of a fingertip, and exits from a portion of a fingerprint. The scattered ray transmits the transparent electrode and the substrate to be photoelectrically converted by solid state imaging devices provided on a front face of the substrate, and thereby an image of the fingerprint can be obtained. The fingerprint entering apparatus is featured by the thickness of the substrate being within a range from about a half to three times as large as the pixel pitch of the solid state imaging devices.

Abstract: A compact and lightweight two-dimensional image pickup apparatus comprises two-dimensional photoelectric converters arranged on a substrate, a base member for supporting the substrate, electronic parts for processing the electric signals of said photoelectric converters and an apparatus cabinet containing the above components, wherein said base member is formed by a metal-based printed circuit board and said electronic parts are mounted on said base member or, alternatively, said base member and part or all of said apparatus cabinet are formed by a metal-based printed circuit board and said electronic parts are mounted on said printed circuit board.

Abstract: An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Abstract: An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Abstract: A contact-type image sensor assembly including: an image sensor; a light source for illuminating an original document which has image information; an optical lens for imaging light reflected by the original document onto the image sensor; and a supporting member for supporting the image sensor, the light source and the optical lens, wherein the supporting member includes: a first supporting member for maintaining the distance from the surface of the original document and the light incidental side of the optical lens at a predetermined distance; a second supporting member disposed individually from the first supporting member and acting to maintain the distance from the light emission side of the optical lens to the light receiving side of the image sensor; and a third supporting member for supporting the first and second supporting members at predetermined positions and the third supporting member supports the first and second supporting members in this way that their positions can be adjusted.

Abstract: An electromagnetic transmitting apparatus for a camera includes a first device at the main body of the camera to convert electric energy within the camera main body to magnetic energy, and a second device to receive the magnetic energy and convert it into electric energy. The second device is in a unit which can be mounted on the camera body, so that the electric energy at the camera main body is transmitted to the unit including the second device when the unit is mounted on the camera main body.