Patents by Inventor Fumitoshi Fujisaki

Fumitoshi Fujisaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
    Patent number: 6716675
    Abstract: The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: April 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Masaki Waki, Fumitoshi Fujisaki, Masao Takehiro, Shinichiro Maki
  • Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
    Publication number: 20030006501
    Abstract: The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
    Type: Application
    Filed: August 23, 2002
    Publication date: January 9, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Masaki Waki, Fumitoshi Fujisaki, Masao Takehiro, Shinichiro Maki
  • Semiconductor device and method of producing the same
    Patent number: 6191494
    Abstract: A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: February 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Nobuo Ooyama, Shinichiro Maki, Fumitoshi Fujisaki, Syunichi Kuramoto, Yukio Saigo, Yasuo Yatsuda, Youichi Matae, Atsushi Yano, Kazuto Tsuji, Masafumi Tetaka
  • Method and apparatus for fabricating semiconductor device
    Patent number: 6159770
    Abstract: There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: December 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Masafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda, Yoshiyuki Yoneda, Akihiro Shigeno, Ryoichi Yokoyama, Fumitoshi Fujisaki, Masao Fukunaga, Kazuto Tsuji, Terumi Kamifukumoto, Kenji Itasaka, Masanori Onodera