Patents by Inventor Fumitoshi Goto

Fumitoshi Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9544059
    Abstract: An optical module includes: a first circuit board including a first signal terminal part and a first ground terminal part formed on a front surface; and a second circuit board including a second signal terminal part and a second ground terminal part formed on a back surface. The first circuit board further includes: a first dielectric layer; a first signal wire formed on a front surface of the first dielectric layer; a first ground conductor layer formed on a back surface of the first dielectric layer; and a first through ground conductor passing through the first dielectric layer. The first ground terminal part is formed, in a first region and a second region respectively located on both sides of the first signal terminal part in a first direction, and in a third region prescribed at a location beyond the first signal terminal part in a second direction.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: January 10, 2017
    Assignee: OCLARO JAPAN, INC.
    Inventor: Fumitoshi Goto
  • Patent number: 9500825
    Abstract: A flexible wiring board includes a conductive film provided on one surface of a substrate. The conductive film includes a plurality of pad portions to which a plurality of connection electrodes are respectively bonded with solder, and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged. The plurality of pad portions include a terminal portion electrically connected with the wiring portion, and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion. The solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion. The land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: November 22, 2016
    Assignee: OCLARO JAPAN, INC.
    Inventors: Kazuhiro Komatsu, Takuma Ban, Fumitoshi Goto, Yoichiro Igarashi
  • Patent number: 9485023
    Abstract: A plurality of radio access units form the single cell of a first communication system, while forming respective individual multi-cells of a second communication system within the single cell. The plurality of radio access units transmit a downstream signal of the first communication system input from a main unit to a terminal using the first communication system of the single cell, while each transmitting a downstream signal of the second communication input from the main unit to a terminal using the communication system of the corresponding respective one of the multi-cells.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: November 1, 2016
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Takaaski Sato, Fumitoshi Goto, Masafumi Shiohara
  • Publication number: 20160259138
    Abstract: A flexible wiring board includes a conductive film provided on one surface of a substrate. The conductive film includes a plurality of pad portions to which a plurality of connection electrodes are respectively bonded with solder, and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged. The plurality of pad portions include a terminal portion electrically connected with the wiring portion, and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion. The solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion. The land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.
    Type: Application
    Filed: February 26, 2016
    Publication date: September 8, 2016
    Inventors: Kazuhiro KOMATSU, Takuma BAN, Fumitoshi GOTO, Yoichiro IGARASHI
  • Publication number: 20160095211
    Abstract: An optical module includes: a first circuit board including a first signal terminal part and a first ground terminal part formed on a front surface; and a second circuit board including a second signal terminal part and a second ground terminal part formed on a back surface. The first circuit board further includes: a first dielectric layer; a first signal wire formed on a front surface of the first dielectric layer; a first ground conductor layer formed on a back surface of the first dielectric layer; and a first through ground conductor passing through the first dielectric layer. The first ground terminal part is formed, in a first region and a second region respectively located on both sides of the first signal terminal part in a first direction, and in a third region prescribed at a location beyond the first signal terminal part in a second direction.
    Type: Application
    Filed: September 29, 2015
    Publication date: March 31, 2016
    Inventor: Fumitoshi GOTO
  • Publication number: 20150236786
    Abstract: A plurality of radio access units form the single cell of a first communication system, while forming respective individual multi-cells of a second communication system within the single cell. The plurality of radio access units transmit a downstream signal of the first communication system input from a main unit to a terminal using the first communication system of the single cell, while each transmitting a downstream signal of the second communication input from the main unit to a terminal using the communication system of the corresponding respective one of the multi-cells.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 20, 2015
    Inventors: Takaaski Sato, Fumitoshi Goto, Masafumi Shiohara
  • Publication number: 20130004176
    Abstract: A plurality of radio access units (108-1 to 108-n) form the single cell (#120) of a first communication system, while forming respective individual multi-cells (#130-1 to #130-n) of a second communication system within the single cell (#120). The plurality of radio access units (108-1 to 108-n) transmit a downstream signal of the first communication system input from a main unit (107) to a terminal using the first communication system of the single cell (#120), while each transmitting a downstream signal of the second communication system input from the main unit (107) to a terminal using the second communication system of the corresponding respective one of the multi-cells (#130-1 to #130-n).
    Type: Application
    Filed: April 12, 2011
    Publication date: January 3, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Takaaski Sato, Fumitoshi Goto, Masafumi Shiohara
  • Publication number: 20110110640
    Abstract: Provided are an optical communication module which are capable of reducing a risk that an optical fiber may be detached from the optical fiber support fixture. The optical fiber support fixture includes a cylindrical body portion in which a through hole allowing an optical fiber to pass therethrough is formed. The cylindrical body portion has a circumferential surface portion in which a gap that the optical fiber crosses at a time of allowing the optical fiber to pass through the through hole is formed. The cylindrical body portion has an arbitrary point and another point on a center axis of the cylindrical body portion, the arbitrary point and the another point having different positional correspondence relationships with the gap on planes perpendicular to the center axis passing through the arbitrary point and the another point.
    Type: Application
    Filed: November 10, 2010
    Publication date: May 12, 2011
    Inventors: Fumitoshi GOTO, Toshikazu Otake, Koichi Omori, Kazutaka Nagoya, Kouhei Sagara
  • Patent number: 7680452
    Abstract: A booster capable of preventing itself from adversely influencing a base station. This booster comprises a plurality of downstream signal amplifying parts (111-1 to 111-4) and a plurality of upstream signal amplifying parts (112-1 to 112-4). A received signal analyzing part (116) analyzes the perch channel information of a signal received from a base station to generate analysis information. When the analysis information shows that the reception quality of the received signal is below a threshold value, halt control parts (118,124) halts the operations of those ones of the downstream signal amplifying parts (111-1 to 111-4) and upstream signal amplifying parts (112-1 to 112-4) that are related to that analysis information.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: March 16, 2010
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Oodachi, Keisho Fujiwara, Masashi Shiohara, Naoki Uchida, Takayoshi Morino, Fumitoshi Goto
  • Patent number: 7313331
    Abstract: The printed circuit board with the respective components of the optical transmitter-receiver mounted thereon is split into several parts, the fixing position of which respective parts with regard to the housing is set according to the standardized size of the respective components and which respective parts are interconnected through an electric connector and so forth, which makes the height of the transmitter-receiver lower. The split circuit boards are overlapped such that they make no contact with one another so as to enlarge the area of the circuit boards or practically increase the packaging area of the respective components, which realizes the structural compactness of the optical transmitter-receiver. The packaging side of the respective components is selected in an arbitrary manner according to the cooling direction of the respective ICs, which allows such direction to be oriented to the side of the heat sinks so as to enhance cooling behavior.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: December 25, 2007
    Assignee: OpNext Japan, Inc.
    Inventors: Mitsuo Akashi, Hironori Saitoh, Fumitoshi Goto, Raju Kankipati, Hirofumi Nakagawa
  • Publication number: 20070243823
    Abstract: A booster capable of preventing itself from adversely influencing a base station. This booster comprises a plurality of downstream signal amplifying parts (111-1 to 111-4) and a plurality of upstream signal amplifying parts (112-1 to 112-4). A received signal analyzing part (116) analyzes the perch channel information of a signal received from a base station to generate analysis information. When the analysis information shows that the reception quality of the received signal is below a threshold value, halt control parts (118,124) halts the operations of those ones of the downstream signal amplifying parts (111-1 to 111-4) and upstream signal amplifying parts (112-1 to 112-4) that are related to that analysis information.
    Type: Application
    Filed: October 19, 2005
    Publication date: October 18, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Oodachi, Keisho Fujiwara, Masashi Shiohara, Naoki Uchida, Takayoshi Morino, Fumitoshi Goto
  • Patent number: 6985659
    Abstract: The present invention relates to an optical transmission module comprising two substrates, each of which has an electronic part mounted on the substrate and a terminal area for inputting/outputting an electric signal into/from the electronic part, wherein an electrical connection is made between the terminal areas of said two substrates by use of a flexible substrate having a structure constituted of at least three layers, and thereby a high frequency signal is transmitted between the electronic part mounted on one substrate and the electronic part mounted on the other substrate through the flexible substrate while confining an electromagnetic field. In addition, the present invention provides an optical transmission module characterized in that a slit formed in a ground plane on a connection section of a three-layer flexible substrate reduces a disturbance in electromagnetic field, making it possible to improve the transmission characteristic of a high frequency signal.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: January 10, 2006
    Assignee: OpNext Japan, Inc.
    Inventors: Makoto Torigoe, Kazumi Kawamoto, Takashi Suga, Hiroyasu Sasaki, Fumitoshi Goto
  • Publication number: 20050176310
    Abstract: In a connection structure of a rigid printed circuit board and a flexible circuit each having a plurality of connection terminals, there are provided a connection structure that can obtain a necessary connection strength and prevent short-circuiting between adjacent connection terminals, and a connection process thereof. A rigid printed circuit board having a plurality of connection terminals is superimposed on a flexible circuit that puts a conductive pattern having connection terminals having the same configuration as that of the connection terminals of the rigid printed circuit board at an end thereof by flexible insulating resin, and connected to the flexible circuit with a solder due to thermo compression. A solder resist is disposed on the flexible insulating resin on the flexible circuit, and the solder connection can be realized by using a solder plating formed on one or both electrodes of the rigid printed circuit board and the flexible circuit while an amount of occlusion gas is controlled.
    Type: Application
    Filed: January 4, 2005
    Publication date: August 11, 2005
    Inventors: Kouichi Kataoka, Katsuya Ohno, Shinichi Okayama, Nobuyuki Ura, Fumitoshi Goto, Yutaka Kakami
  • Publication number: 20040264882
    Abstract: The present invention relates to an optical transmission module comprising two substrates, each of which has an electronic part mounted on the substrate and a terminal area for inputting/outputting an electric signal into/from the electronic part, wherein an electrical connection is made between the terminal areas of said two substrates by use of a flexible substrate having a structure constituted of at least three layers, and thereby a high frequency signal is transmitted between the electronic part mounted on one substrate and the electronic part mounted on the other substrate through the flexible substrate while confining an electromagnetic field.
    Type: Application
    Filed: July 30, 2003
    Publication date: December 30, 2004
    Applicant: OpNext Japan, Inc.
    Inventors: Makoto Torigoe, Kazumi Kawamoto, Takashi Suga, Hiroyasu Sasaki, Fumitoshi Goto
  • Publication number: 20040208633
    Abstract: The printed circuit board with the respective components of the optical transmitter-receiver mounted thereon is split into several parts, the fixing position of which respective parts with regard to the housing is set according to the standardized size of the respective components and which respective parts are interconnected through an electric connector and so forth, which makes the height of the transmitter-receiver lower. The split circuit boards are overlapped such that they make no contact with one another so as to enlarge the area of the circuit boards or practically increase the packaging area of the respective components, which realizes the structural compactness of the optical transmitter-receiver. The packaging side of the respective components is selected in an arbitrary manner according to the cooling direction of the respective ICs, which allows such direction to be oriented to the side of the heat sinks so as to enhance cooling behavior.
    Type: Application
    Filed: September 9, 2002
    Publication date: October 21, 2004
    Applicant: OpNext Japan, Inc.
    Inventors: Mitsuo Akashi, Hironori Saitoh, Fumitoshi Goto, Raju Kankipati, Hirofumi Nakagawa