Abstract: A wafer container cleaner includes a cleaning bath capable of accommodating a housing jig that houses a wafer container including a container body and a cover, liquid-supply nozzles for supplying cleaning liquid or the like into the cleaning bath, and a liquid-discharge nozzle for discharging to-be-discharged fluid out of the cleaning bath. The container body has a depth wall at a side opposite a container opening. In an accommodating state where the container body mounted on the storage fixture with the container opening facing downward is accommodated in the cleaning bath, the liquid-supply nozzles are provided so that respective liquid-supply openings through which the cleaning liquid or the like is discharged face an inner side of the depth wall and the liquid-discharge nozzle is provided so that a discharge opening through which the to-be-discharged fluid is sucked in faces a center of the inner side of the depth wall.

Abstract: A method and a system for cleaning a work, the sum A of the areas (mm2), the sum B of the areas (mm2) and the determined supply flow rate Q (L/min) or the supply flow rate Q (L/min) and one or both of the determined sum A of the areas (mm2) and the determined sum B of the areas (mm2) satisfy the predetermined relations.